Results 51 to 60 of about 519,396 (299)
Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
doaj +1 more source
In this study, we found that human cervical‐derived adipocytes maintain intracellular iron level by regulating the expression of iron transport‐related proteins during adrenergic stimulation. Melanotransferrin is predicted to interact with transferrin receptor 1 based on in silico analysis.
Rahaf Alrifai +9 more
wiley +1 more source
Tau acetylation at K331 has limited impact on tau pathology in vivo
We mapped tau post‐translational modifications in humanized MAPT knock‐in mice and in amyloid‐bearing double knock‐in mice. Acetylation within the repeat domain, particularly around K331, showed modest increases under amyloid pathology. To test functional relevance, we generated MAPTK331Q knock‐in mice.
Shoko Hashimoto +3 more
wiley +1 more source
Analysis on mechanism of material removal rate and surface flow machining process [PDF]
A novel finishing technique called abrasive flow machining (AFM) uses abrasive particles as the instrument for material removal. The term "self-deformable stone" refers to the abrasive particle-containing carrier medium, and AFM is commonly known as "no ...
Kondala Rao Peram, Ranga Janardhana G.
doaj +1 more source
Intelligent optimization of wire-EDM parameters for surface roughness and material removal rate while machining WC-Co composite [PDF]
Kapil Gupta
openalex +1 more source
Calpain small subunit homodimerization is robust and calcium‐independent
Calpains dimerize via penta‐EF‐hand (PEF) domains. Using single‐molecule force spectroscopy, we measured the strength and kinetics of PEF–PEF homodimer binding. The interaction is robust, shows a transient conformational step before dissociation, and remains largely insensitive to Ca2+.
Nesha May O. Andoy +4 more
wiley +1 more source
A workpiece attitude during polishing process is known to affect material removal rate distribution, which is one of the most significant properties in polishing process.
Yohei HASHIMOTO +3 more
doaj +1 more source
Structural insights into an engineered feruloyl esterase with improved MHET degrading properties
A feruloyl esterase was engineered to mimic key features of MHETase, enhancing the degradation of PET oligomers. Structural and computational analysis reveal how a point mutation stabilizes the active site and reshapes the binding cleft, expading substrate scope.
Panagiota Karampa +5 more
wiley +1 more source
Machine Learning-Based Prediction of EDM Material Removal Rate and Surface Roughness
Examining the electrical discharge machining (EDM) process is challenging in manufacturing technology due to the complexity of the physical events that take place in the gaps between electrodes.
Isam Qasem, Amjad Alsakarneh
doaj +1 more source
A comprehensive genomic and proteomic analysis of cervical cancer revealed STK11 and STX3 as a potential biomarkers of chemoradiation resistance. Our study demonstrated EGFR as a therapeutic target, paving the way for precision strategies to overcome treatment failure and the DNA repair pathway as a critical mechanism of resistance.
Janani Sambath +13 more
wiley +1 more source

