Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
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Modulation of Homer1 EVH1 domain internal dynamics by putative autism‐associated mutations
FEBS Letters, EarlyView.The putative autism‐associated M65I and S97L variants of the EVH1 domain of the postsynaptic scaffold protein Homer1 do not exhibit substantial changes in their overall structure or partner binding. Both of them, but especially the M65I variant, show altered internal dynamics relative to the wild‐type domain on the μs‐ms timescale, indicated by the ...
Fanni Farkas +6 more
wiley +1 more source
Cost and Performance Comparison of a Membrane Bioreactor (MBR) Plant and a Bardenpho Plant for Wastewater Treatment [PDF]
, 2013 Rotorua District Council constructed a membrane bioreactor (MBR) system to work in parallel with the existing Bardenpho system, to improve the overall capacity and removal efficiency of the wastewater treatment plant.
Rachmani, Asaf
core
An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing [PDF]
, 2015 There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are ...
Cheung, Chi Fai +3 more
core +1 more source
FEBS Letters, EarlyView.An unexpected alternative interaction site for ethyl viologen was identified in formate dehydrogenase 1 from Methylorubrum extorquens. Combined mutagenesis, kinetic analysis, and docking revealed that aromatic residues near an iron–sulfur cluster enable flavin mononucleotide‐independent electron transfer, offering a framework for engineering improved ...
Eleni G. Poloniataki, Yong Hwan Kim
wiley +1 more source
Optimasi Pengaturan Parameter Bubut pada Material SKD 11 terhadap Kekasaran dan Material Removal Rate Menggunakan Metode Taguchi Grey Fuzzy [PDF]
, 2023 Within the increasing of competitive and demand for quality product in the market place, therefore the demands for quality for metal cutting are getting higher, one of them are turning process.
Sidi, Pranowo +2 more
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Machine Learning-Based Prediction of EDM Material Removal Rate and Surface Roughness
Journal of Manufacturing and Materials ProcessingExamining the electrical discharge machining (EDM) process is challenging in manufacturing technology due to the complexity of the physical events that take place in the gaps between electrodes.
Isam Qasem, Amjad Alsakarneh
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Electron transfer between complexes III and IV in S. cerevisiae mitochondrial membranes
FEBS Letters, EarlyView.Mitochondrial oxidative phosphorylation in S. cerevisiae mitoplasts is limited by complex IV catalytic capacity, rather than two‐dimensional cytochrome c diffusion. At physiological cytochrome c : supercomplex ratios at salinity equivalent to that of 20 mm monovalent salt, activity is maximized, indicating that this low ionic strength accurately mimics
Ana Paula Lobez +2 more
wiley +1 more source
Struvite crystallisation and recovery using a stainless steel structure as a seed material. [PDF]
, 2007 A metallic system acting as a seed substrate has been designed and developed in order to assess its efficiency in recovering phosphorus as struvite. The device, consisting of two concentric stainless steel meshes, was immerged in the upper section of ...
Hobbs, Phil +10 more
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Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2019 A workpiece attitude during polishing process is known to affect material removal rate distribution, which is one of the most significant properties in polishing process.
Yohei HASHIMOTO +3 more
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