Results 11 to 20 of about 385 (173)

Untethered Autonomous Holonomic Mobile Micromanipulator for Operations in Isolated Confined Spaces

open access: yesAdvanced Intelligent Systems
With increasing miniaturization of portable electronic devices, conventional positioning systems have become inefficient in terms of size and energy consumption.
Ryosuke Kinoshita   +7 more
doaj   +2 more sources

Nanoporous Capillary Gripper for Ultragentle Micro-Object Manipulation. [PDF]

open access: yesAdv Sci (Weinh)
Microscale pick‐and‐place requires low‐pressure handling and controllable adhesion due to the increased fragility and reduced size of components. A capillary gripper with nanoporous surface enables switchable capillary adhesion, achieving ultralow “off‐state” stickiness for reliable micro‐scale pick‐and‐place of delicate objects.
Kim SJ   +5 more
europepmc   +2 more sources

Micro-LEGO for MEMS

open access: yesMicromachines, 2019
The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication.
Seok Kim
doaj   +1 more source

Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

open access: yesIEEE Access, 2022
Metal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever-increasing demand for MOX gas sensors, there is a clear need for a low cost, compact and high-performance package.
Serguei Stoukatch   +5 more
doaj   +1 more source

Devices for quality control of welded joints of leads of packageless chips [PDF]

open access: yesТехнологія та конструювання в електронній апаратурі, 2013
The author considers the design and operation of two devices for quality control of welded joints between aluminium leads of packageless microcircuits and contact pads of a thin-film circuit.
V. G. Spirin
doaj   +1 more source

Vision and Force Feedback Control for Microassembly Process

open access: yesMATEC Web of Conferences, 2016
Microassembly process is one of the difficulties in the field of manufacturing. According to the structural characteristics and assembly process difficultly of 3D meso-scale micro-devices and the requirement of multi-axis control in coaxial alignment ...
Chen Zhi yao   +4 more
doaj   +1 more source

Virtual reality for microassembly [PDF]

open access: yesSPIE Proceedings, 2007
The growing demand for advanced micro-devices that integrate various sensors and actuators, e.g. for biomedical applications, has created a strong need for assembly units that can meet high precision and manipulation requirements. However, developing a sophisticated machine that can fulfill these requirements solves only a part of the problem ...
Martin Probst   +3 more
openaire   +1 more source

Microassembly on silicon board for accelerometer [PDF]

open access: yesTekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2013
The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.
Spirin V. G.
doaj   +2 more sources

Light-Responsive Materials in Droplet Manipulation for Biochemical Applications. [PDF]

open access: yesAdv Mater
Light‐driven droplet manipulation strategies, featured in contactless interaction, high‐spatiotemporal resolution, and biocompatibility, are considered promising, particularly for biochemical applications. Special attention is paid to the underlying mechanisms, recent advancements of light‐responsive materials, and the most notable applications of ...
Cheng G, Kuan CY, Lou KW, Ho YP.
europepmc   +2 more sources

Comparing Different Light Models for Virtual Electrodes in Optoelectronic Tweezers. [PDF]

open access: yesElectrophoresis
ABSTRACT Optoelectronic tweezers (OET) allow for the physical manipulation of particles of interest via dielectrophoresis (DEP) in microfluidic devices. To produce the nonuniform electric field required to enable DEP, light is used to expose a photoconductive film and create a so‐called virtual electrode (VE).
Guzman-Saleh E   +2 more
europepmc   +2 more sources

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