Results 131 to 140 of about 5,809 (181)

The teaching of microelectromechanical systems (MEMS)

Proceedings 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) 'Systems Education in the 21st Century' (Cat. No.99-63794), 2003
MEMS technology is now where integrated circuit technology was about 30 years ago. It is clearly going to be pervasively important. Both commercial volume and patents on MEMS are growing at rates exceeding 20% annually. The teaching of MEMS technology, now in its early stages, must keep pace.
Mona E. Zaghloul, David J. Nagel
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Microelectromechanical systems (MEMS) tutorial

Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270), 2002
Using the fabrication techniques and materials of microelectronics as a basis, MEMS processes construct both mechanical and electrical components. Mechanical components in MEMS, like transistors in microelectronics, have dimensions that are measured in microns and numbers measured from a few to millions.
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Microelectromechanical systems (MEMS)

1997 IEEE Aerospace Conference, 1997
The following topics are dealt with: MEMS fundamentals; MEMS fabrication technology; MEMS market and industry structure; defense applications; investment assessment; inertial measurement devices; multiple device chips; optical MEMS components; monolithic free-space optical disk pickup head; digital micromirror display; optomechanical displays ...
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Packaging and Microelectromechanical Systems (MEMS)

2007 8th International Conference on Electronic Packaging Technology, 2007
Packaging is critical to the advancement of microsystems integrating microelectromechanical systems (MEMS) with microelectronic, optoelectronic and microwave devices. This paper discusses microsystems packaging with three cases: a) packaging of MEMS: flip-chip assembly to interconnect MEMS devices with other components; b) packaging for MEMS: novel ...
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The Future of Microelectromechanical systems (MEMS)

Strain, 2009
Abstract:  MEMS‐based products produced in 2005 had a value of $8bn, 40% of which was sensors. The balance was for products that included micromachined features, such as ink jet print heads, catheters and RF IC chips with embedded inductors. Growth projections follow a hockey stick curve, with the value of products rising to $40bn in 2015 and $200bn in
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Nano/Microelectromechanical Systems (NEMS/MEMS)

2020
Micro/nanoelectromechanical systems (M/NEMS) is a process technology that integrates both electrical and mechanical components with dimensions in micron/nanometer. M/NEMS technologies have attracted the attention of researchers in both scientific studies and technical applications.
Prasantha R. Mudimela, Rekha Chaudhary
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Characterization of a Microelectromechanical Systems (MEMS) Microphone

14th AIAA/CEAS Aeroacoustics Conference (29th AIAA Aeroacoustics Conference), 2008
*† A method for characterizing non-condenser microphone frequency response up through at least 100 kHz has been developed and validated. This method exposes a device under test microphone and a reference microphone to the same acoustic field. A frequency response function between the two devices is then determined through a sequence of measurements and
J. Patrick King, James Underbrink
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Introduction to applications and industries for microelectromechanical systems (MEMS)

International Test Conference, 2003. Proceedings. ITC 2003., 2004
Microelectromechanical Systems (MEMS) have gained acceptance as viable products for many commercial and government applications. MEMS are currently being used as displays for digital projection systems, sensors for airbag deployment systems, inkjet print head systems, and optical routers. This paper will discuss current and future MEMS applications.
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Failure Analysis Issues in Microelectromechanical Systems (MEMS)

Microelectronics Reliability, 2005
Abstract Failure analysis and device characterization of MEMS components are critical steps in understanding the root causes of failure and improving device performance. At the wafer and die level these tasks can be performed with little or no sample preparation.
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Integrated ferroelectric microelectromechanical systems (MEMS)

Integrated Ferroelectrics, 1995
Abstract A ferroelectric test chip has been fabricated consisting of 1) piezoelectric (PZT) microsensors (accelerometers), 2) low-voltage, 3-μm, n-well CMOS signal conditioning electronics, 3) high-voltage (HVMOS) drive electronics, and 4) PZT microactuator diaphragms and cantilevers.
D. L. Polla, P. J. Schiller
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