Results 121 to 130 of about 49,281,268 (309)
Oxygen‐tunnel (OT) indium tin oxide (ITO) vertical channel transistors (VCTs) enable reliable, high‐density gain‐cell memory for monolithic 3D integration. A sandwiched SiN/SiO2/SiN OT stack selectively regulates oxygen transport, suppressing parasitic electrode oxidation while stabilizing channel oxygen vacancies, thereby suppressing carrier injection
Hyeonho Gu +17 more
wiley +1 more source
PCCNoC: Packet Connected Circuit as Network on Chip for High Throughput and Low Latency SoCs. [PDF]
Zhou X, Hao P, Liu D.
europepmc +1 more source
A swelling‐programmed micropatterned hydrogel guides adherent cells through a controlled transition from cell–matrix anchoring to cadherin‐mediated cell–cell compaction, enabling rapid assembly of high‐viability spheroids with defined size and morphology.
Han Gyeol Nam +8 more
wiley +1 more source
Author Correction: Reconstructing the maize leaf regulatory network using ChIP-seq data of 104 transcription factors. [PDF]
Tu X +10 more
europepmc +1 more source
A Generic Network on Chip Model
We present a generic network on chip model (named GeNoC) intended to serve as a reference for the design and the validation of high level specifications of communication virtual modules. The definition of the model relies on three independent groups of constrained functions: routing and topology, scheduling, interfaces.
Schmaltz, J., Borrione, D.
openaire +1 more source
An intrinsic photoactive star‐shaped zinc phtalocyanine‐poly(L‐glutamic acid) (ZnPc‐PGA) nanoplatform for multimodal glioblastoma (GBM) therapy and brain‐targeted elivery. A ZnPc‐PGA‐based multifunctional theranostic nanocarrier platform enables image‐guided, multimodal GBM therapy. ZnPc‐PGA nanocarriers support the integration of fluorescence imaging,
Amina Benaicha‐Fernández +14 more
wiley +1 more source
Modeling and Performance Analysis of a Fault-Tolerant 3D Photonic Network-on-Chip Based on Hybrid Photonics-Plasmonics. [PDF]
Zhixun L +5 more
europepmc +1 more source
Flexible piezoresistive pressure sensors underpin wearable and soft electronics. This review links sensing physics, including contact resistance modulation, quantum tunneling and percolation, to unified materials/structure design. We highlight composite and graded architectures, interfacial/porous engineering, and microstructured 3D conductive networks
Feng Luo +2 more
wiley +1 more source
Power Optimal Network-on-Chip Interconnect Design
A large part of today's multi-core chips is interconnect. Increasing communication complexity has made essential new strategies for interconnects, such as Network on Chip.
Varghese, K, Kuri, Joy, Vikas, G
core
A Latency-Optimized Network-on-Chip with Rapid Bypass Channels. [PDF]
Ma W, Gao X, Gao Y, Yu N.
europepmc +1 more source

