Preparation and Properties of AgNPs Loaded CMC-CMCS Composite Packaging Films with Dual Reduction and Stabilization Functions. [PDF]
Polymers (Basel)Yang C +7 more
europepmc +1 more source
Effect of Packaging Materials on Lettuce (<i>Lactuca sativa</i> var. <i>capitata</i>) Chemical Quality Under Cold Storage. [PDF]
Int J Food SciOanh VTK, Alemu TT.
europepmc +1 more source
Solvent-free non-isocyanate polyurethane thermoplastic films from lignin and castor oil: toward sustainable packaging applications. [PDF]
RSC AdvGanesan K +3 more
europepmc +1 more source
Potential of Egg White Protein-Based Films for Maintaining the Quality of Fresh-Peeled Garlic. [PDF]
FoodsBaquero-Aznar V +4 more
europepmc +1 more source
Active Packaging Technologies with an Emphasis on Antimicrobial Packaging and its Applications [PDF]
Journal of Food Science, 2003 In response to the dynamic changes in current consumer demand and market trends, the area of Active Packaging (AP) is becoming increasingly significant. Principal AP systems include those that involve oxygen scavenging, moisture absorption and control,
Panuwat Suppakul
exaly +2 more sources
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When the Best Packaging Is No Packaging
International Commerce Review, 2010At first glance, recycling waste packaging seems ‘green’. However, it’s a costly business, requiring a large amount of CO2-intensive transportation and processing. Instead, why not simply eliminate the packaging? An Italian experiment shows this approach can have many benefits.
Chieko Minami +2 more
openaire +2 more sources
Signal Integrity Flow for System-in-Package and Package-on-Package Devices
Proceedings of the IEEE, 2009As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address. The design flow of the SiP should therefore take into account these issues from the beginning.
Paolo Pulici +6 more
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A study of package warpage for package on package (PoP)
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010Package warpage is a primary concern in a package-on-package. To enhance the accuracy of modeling prediction, viscoelastic parameters, the change of material properties after injection mold cure (IMC) and post mold cure (PMC) temperature and it's time, and cure shrinkage were studied with a dynamic modulus analysis (DMA) and a thermal mechanical ...
Masazumi Amagai, Yutaka Suzuki
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The development of a novel stacked package: package in package
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585), 2004Stacked die chip scale packages (CSPs) or fine-pitch BGAs (FBGAs) have been readily adopted and integrated in many handheld products, most notably cellular phones. Such stacked die CSPs are especially useful to reduce the cost, weight, and size of the memory devices needed to support the increased features and applications in cellular phones today.
F. Carson, null Young-Cheol Kim
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Supplementary benefit packages and the level of support management gives the package varies widely from firm to firm. On average, consulting and design firms spend approximately 28.75% of gross annual payroll on benefits (excluding federally‐mandated contributions, which account for an additional 10–12%).
Michael W. Creed +2 more
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