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On-package decoupling optimization with package macromodels
Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003., 2004Suppressing clock-gating-induced noise at the chip-package interface is one of the most challenging power distribution integrity issues. In this paper, accurate and efficient assessment of the effectiveness of on-package decoupling is facilitated by package macromodels which compactly represent packaging parasitics among multiple on-package decoupling ...
Hui Zheng +2 more
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A Study on Package Stacking Process for Package-on-Package (PoP)
56th Electronic Components and Technology Conference 2006, 2006This paper outlines package stacking process guidelines for a package-on-package (PoP) configuration. PoP stacks currently in production or development consist of a bottom package containing a high performance logic device designed to receive a mating top package typically containing high capacity or combination memory devices.
A. Yoshida +7 more
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Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package
IEEE Design & Test, 2015In this work, the thermal analysis is performed to investigate and improve the heat dissipation capability of the fan-out eWLP POP structure. The simulation scheme was validated with the available experimental results conducted previously by Hoe et al. [9]. The 3-D package studied is shown in Figure 1.
Yong Han +3 more
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Avoiding packaging mismatch with flexible packaging
Proceedings of the 21st international conference on Software engineering, 1999To integrate a software component into a system, it must interact properly with the system's other components.
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Plastic Packaging Wrap for Patient Packaging
Journal of Special Operations MedicineBandages have been used in hemorrhage control since at least ancient Egyptian, Greek, and Roman times. The design remained unchanged until the fifth century BCE, when gauze was introduced. Modern bandages are relatively expensive and heavy and are not widely available in low-resource environments. Packaging wrap, sometimes called Saran wrap, cling film,
Patrick, Thompson +2 more
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Chip package interaction for LED packages
Microelectronics Reliability, 2016Abstract Solid-state lightings (SSL) rapidly penetrate the global illumination market because of the energy efficiency and the reliability. The energy efficiency can be easily evaluated but the reliability is not convenient to be estimated. Among several reliability issues, a LED chip level's reliability could be a difficult problem because chip ...
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Bioplastics for food packaging
Trends in Food Science and Technology, 2022Maya Davidovich-Pinhas
exaly
Bio-sourced polymers as alternatives to conventional food packaging materials: A review
Trends in Food Science and Technology, 2021Rahul S Mor, Anand Kishore
exaly