Results 11 to 20 of about 39,831 (163)
R&D of 3 300V SiC MOSFET With Embedded SBD
In this paper, a 3 300 V silicon carbide(SiC) metal-oxide-semiconductor field effect transistors (MOSFET) with embedded schottky barrier diodes(SBD) is developed, where the traditional MOSFET structure is integrated with a titanium-formed Schottky ...
Guoyou LIU +3 more
doaj +1 more source
Devices for express diagnostics of power semiconductor devices and semiconductor converters
The increase in the power of power semiconductor converters operated in the railway industry is associated with the use of group connections of power semiconductor devices in them, the variation in the parameters of which, and, therefore, their unequal ...
E. B. Koroleva +4 more
doaj +1 more source
Affected by high switching speed and parasitic parameters, crosstalk problem of eGaN HEMT in a phase-leg configuration cannot be ignored. By decreasing gate driver turn-off voltage, the false turn-on phenomenon of device caused by crosstalk can be ...
Haihong Qin +4 more
doaj +1 more source
Improving Adhesive Bonding of Al Alloy by Laser-Induced Micro–Nano Structures
In this paper, laser surface treatment of Al alloy was studied by comparison of sandblasting and laser ablation. The effects of laser spot distribution on surface roughness, contact angle, chemical composition and shear strength of Al alloy were analyzed.
Guang Li +7 more
doaj +1 more source
Investigations on 2Cr13 Stainless Valves after Dry-Type Laser Degumming
The disabled glue on valve surfaces is known to reduce aircraft durability and performance. In this paper, glue contaminants were removed from 2Cr13 stainless valves by dry-type laser processing with a cold air gun and compared with the chemical soaking ...
Guang Li +9 more
doaj +1 more source
A Review of Thermal Design for IGBT Module
In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU +5 more
doaj +1 more source
Both large current capability and strong short-circuit (SC) ruggedness are necessary for 3.3 kV SiC MOSFETs to improve system efficiency and reduce costs in industrial and traction applications.
Ximing Chen +9 more
doaj +1 more source
To achieve ultra-deep dimming ratio in LED driver application, the resonant process of LLC resonant converter considering the critical parasitic components has been analyzed in detail with time-domain solution in this paper.
Sen Xu +3 more
doaj +1 more source
Flexible optoelectronic synaptic transistors for neuromorphic visual systems
Neuromorphic visual systems that integrate the functionalities of sensing, memory, and processing are expected to overcome the shortcomings of conventional artificial visual systems, such as data redundancy, data access delay, and high-energy consumption.
Xiao Liu +4 more
doaj +1 more source
Dislocation-related leakage-current paths of 4H silicon carbide
Improving the quality of 4H silicon carbide (4H-SiC) epitaxial layers to reduce the leakage current of 4H-SiC based high-power devices is a long-standing issue in the development of 4H-SiC homoepitaxy.
Wandong Gao +13 more
doaj +1 more source

