Results 151 to 160 of about 2,388 (173)
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Thermo-mechanical finite element analysis in press-packed IGBT design
Microelectronics Reliability, 2000Abstract The reliability of press-packed insulated gate bipolar transistors (IGBTs) depends on satisfactory contact conditions applied at assembly stage and maintained throughout the service life. The objective of this work is the simulation of stresses and strains in press-packed IGBTs due to assembly and thermal cycling.
PIRONDI, Alessandro +4 more
openaire +2 more sources
Asymmetrical Press-Pack IGBT for Modular Multilevel Converter
2023 IEEE Sustainable Power and Energy Conference (iSPEC), 2023Tan Lingqi +6 more
openaire +1 more source
Press-pack IGBTs, semiconductor switches for pulse power
PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251), 2001F. Wakeman, W. Findlay, null Gangru Li
openaire +1 more source
A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss
IEEE Transactions on Electron Devices, 2022Hui Li, Bailing Zhou, Ran Yao
exaly
Short-Circuit Capability Optimization of Press-Pack IGBT by Improving Active Edge Heat Dissipation
IEEE Transactions on Power Electronics, 2023Yue Yu, Hui Li, Ran Yao
exaly
Study on thermal buffering effect of phase change material on press- pack IGBT
International Journal of Heat and Mass Transfer, 2020Hai Ren, Li Ran
exaly
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021
Erping Deng, Zhibin Zhao, Yiming Zhang
exaly
Erping Deng, Zhibin Zhao, Yiming Zhang
exaly