Results 161 to 170 of about 2,388 (173)
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Lifetime prediction for press pack IGBT device by considering fretting wear failure

Microelectronics Reliability, 2023
Hui Li, Francesco Iannuzzo, Ran Yao
exaly  

Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021
Hui Li, Renze Yu, Ran Yao
exaly  

Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation

IEEE Transactions on Electron Devices, 2023
Chunsheng Guo   +2 more
exaly  

Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs

Microelectronics Reliability, 2017
Erping Deng   +2 more
exaly  

A Study on the Failure Evolution to Short Circuit of Nanosilver Sintered Press-Pack IGBT

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020
Hui Li, Haiyang Long, Ran Yao
exaly  

Modeling and Analysis on Overall Fatigue Failure Evolution of Press-Pack IGBT Device

IEEE Transactions on Electron Devices, 2019
Hui Li, Ran Yao, Wei Lai
exaly  

Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2018
Yun-Hui Mei, Guo-Quan Lu
exaly  

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