Results 211 to 220 of about 120,829 (333)

Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives [PDF]

open access: bronze
Xuan Hong   +10 more
openalex   +1 more source

Selection Strategies for Flexible Pressure Sensor Electrode Materials Toward Ultrafast Response

open access: yesAdvanced Functional Materials, EarlyView.
This study reveals, for the first time, how the electrode–organic interface governs the temporal performance of flexible pressure sensors. By pairing high‐conductivity CVD PEDOT with commonly used metal electrodes, the authors demonstrate that interfacial energy alignment dictates microsecond‐scale response, providing a straightforward design strategy ...
Jinwook Baek   +11 more
wiley   +1 more source

Stresses modeling in multilayer semiconductor structures of automobile regulators and predicting the reliability of their operation

open access: diamond, 2020
S. A. Adarchin   +5 more
openalex   +1 more source

Dual‐Interface Engineering of the Source Electrode to Overcome the Intrinsic Injection‐Leakage Trade‐Off in Organic Schottky Barrier Transistors

open access: yesAdvanced Functional Materials, EarlyView.
A charge injection layer is introduced via RIE to decouple the dual functions of the source electrode: lowering contact resistance through doping to enhance charge injection, while SAM modification on the top surface minimizes leakage current. This strategy enables OSBTs to achieve a high on/off ratio with improved stability and performance.
Hye Ryun Sim   +6 more
wiley   +1 more source

Electron–Matter Interactions During Electron Beam Nanopatterning

open access: yesAdvanced Functional Materials, EarlyView.
This article reviews the electron–matter interactions important to nanopatterning with electron beam lithography (EBL). Electron–matter interactions, including secondary electron generation routes, polymer radiolysis, and electron beam induced charging, are discussed.
Camila Faccini de Lima   +2 more
wiley   +1 more source

Three-Dimensional Combustion Field Temperature Measurement Based on Planar Array Sensors. [PDF]

open access: yesMicromachines (Basel)
Huang X   +6 more
europepmc   +1 more source

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