Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging. [PDF]
ACS OmegaNoh T +7 more
europepmc +1 more source
Advanced Functional Materials, EarlyView.This study introduces a novel chloro boron subphthalocyanine/polymer blend OFET sensor achieving 0.005 ppb limit of detection for ammonia at room temperature and high selectivity against similar amines. An original theoretical framework is proposed to describe the sensing mechanism, relating analyte molecular volume and Lewis basicity to sensor ...
Kavinraaj Ella Elangovan +6 more
wiley +1 more source
Effect of rotational field on thermo-acoustic and optical wave propagation in hydrodynamic semiconductors. [PDF]
Sci RepAlshehri HM, Lotfy K.
europepmc +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
Advanced Functional Materials, EarlyView.This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
High gain and high efficiency soft switching quadratic boost converter for renewable energy applications. [PDF]
Sci RepElghabsi F +8 more
europepmc +1 more source
Heterogeneous Integration for Reduced Phase Noise and Improved Reliability of Semiconductor Lasers
, 2015 Sudharsanan Srinivasan
openalex +1 more source
Advanced Functional Materials, EarlyView.Applying a high electric field to a doped organic semiconductor heats up the charge carrier distribution beyond the lattice temperature, enhancing conductivity. It is shown that the associated effective temperature can be used to extract the effective localization length, which is a characteristic length scale of charge transport and provides ...
Morteza Shokrani +4 more
wiley +1 more source
A Fully Si-Compatible Ni/Si<sub>3</sub>N<sub>4</sub>/Al<sub>2</sub>O<sub>3</sub>/<i>p</i> <sup>+</sup> Poly-Si RRAM Device for Analog Synapse and Its System-Level Assessment toward Processing-in-Memory Applications. [PDF]
ACS OmegaLee Y +5 more
europepmc +1 more source
Reliability for Fatigue Strength of Aluminum Bonding Wire used for Power Semiconductor Modules
, 2003 Yasumi Uegai
openalex +1 more source