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Reliability of compound semiconductor devices
2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400), 2002This paper reviews the reliability problems of compound semiconductor devices. These devices suffer from specific failure mechanisms, which are related to their limited maturity. Only the GaAs MESFETs exhibit a stable technology and an assessed reliability. The metallizations employed in HEMTs already benefit from this assessment.
D. Dieci, Fausto Fantini, L. Cattani
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Semiconductor reliability for the next century
Physics World, 1993The electronics industry now routinely produces devices with up to 1000 million transistors on a single semiconductor chip and this VLSI (very-large-scale integration) revolution shows no sign of stopping. As computer memory requirements push VLSI microfabrication technologies to new extremes, the next generation of dynamic random access memory (DRAM ...
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RELIABILITY AND RADIATION HARDNESS OF COMPOUND SEMICONDUCTORS
International Journal of High Speed Electronics and Systems, 2003A thorough understanding of reliability and radiation hardness is required in order to use compound semiconductors in space, or in other environments involving radiation and/or extended temperature operation. This paper discusses those issues for several types of compound semiconductors that are of interest for high-performance applications.
Sammy Kayali, Allan H. Johnston
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Noise as reliability screening for semiconductor lasers [PDF]
Applied Physics B: Lasers and Optics, 2003 The low-frequency electrical noise in semiconductor lasers is measured and used for device-reliability screening, which is a sensitive and non-destructive method. In the experiment, we developed some approaches to improve the validity of reliability screening by using noise criteria.
Y. Xiaosong +4 more
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Reliability evaluation of semiconductor using ultrasound
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2002The semiconductor packaging industry is spending a great deal of time and effort developing thinner and thinner packages. Ultrasound works by measuring the amount of signal reflected from material interfaces. Thin packages create a potential problem because the resultant reflected signal from the die top and die attach layers can be nearly superimposed
Joonhyun Lee +3 more
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Semiconductor Memory Reliability
2009This chapter contains sections titled: General Reliability Issues RAM Failure Modes and Mechanisms Nonvolatile Memory Reliability Reliability Modeling and Failure Rate Prediction Design for Reliability Reliability Test Structures Reliability Screening and Qualification This chapter contains sections ...
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Practical applications of semiconductor reliability modeling
2015 Annual Reliability and Maintainability Symposium (RAMS), 2015A practical methodology for modeling the reliability of deep submicron (
David A. Sunderland +3 more
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The investigation of semiconductor shipping bag reliability
2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), 2015The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability ...
Yanju Lisa Yu +4 more
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Reliability Evaluation and Prediction for Discrete Semiconductors
IEEE Transactions on Reliability, 1980The use of accelerated step-stress and constant stress-in-time test techniques is demonstrated for generating models for predicting reliability at use conditions. Reliability prediction models were obtained for a signal diode, signal and power transistors, silicon trolled rectifier, and metal oxide varistor.
A. Poe, Erwin A. Herr, A. Fox
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Reliability assurance of individual semiconductor components
Proceedings of the IEEE, 1974Where small numbers of highly reliable semiconductor devices are required, conventional methods of procurement are found to have deficiencies. An approach to procurement is proposed which is cost effective, accommodates new device types, and assures reliability in the individual device.
D.V. Sulway +2 more
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