Results 21 to 30 of about 2,142,347 (390)
Technology and Applications of Wide Bandgap Semiconductor Materials: Current State and Future Trends
Silicon (Si)-based semiconductor devices have long dominated the power electronics industry and are used in almost every application involving power conversion.
Omar Sarwar Chaudhary+3 more
semanticscholar +1 more source
Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
Due to their superior material properties, wide bandgap (WBG) semiconductors enable the application of power electronics at higher temperature operation, higher frequencies, and higher efficiencies compared to silicon (Si).
Li‐shuenn Wang+4 more
semanticscholar +1 more source
The channel temperature distribution and breakdown points are difficult to monitor for the traditional p-GaN gate HEMTs under high power stress, because the metal gate blocks the light.
Zhanfei Han+10 more
doaj +1 more source
Surface free energy and microarray deposition technology [PDF]
Microarray techniques use a combinatorial approach to assess complex biochemical interactions. The fundamental goal is simultaneous, large-scale experimentation analogous to the automation achieved in the semiconductor industry.
Aussillous+8 more
core +1 more source
Due to the continuous demands for highly reliable and cost-effective power conversion, quantified reliability performances of the power electronics converter are becoming emerging needs.
Ke Ma, U. Choi, F. Blaabjerg
semanticscholar +1 more source
Overview of Wide/Ultrawide Bandgap Power Semiconductor Devices for Distributed Energy Resources
This article provides an overview of power semiconductor devices (PSDs) for the distributed energy resource (DER) system. To begin with, an overview of electrically triggered silicon carbide (SiC) and gallium nitride (GaN) devices followed by a brief ...
S. Mazumder+16 more
semanticscholar +1 more source
WBG-Based PEBB Module for High Reliability Power Converters
The increasing presence of power electronic converters in the modern world – from electric vehicles, up to industrial applications – brings up concerns about their reliability, especially in the case of the Wide Band-Gap (WBG) devices ...
Sebastian Baba+3 more
doaj +1 more source
The reliability of semiconductor materials with electrical and optical properties are connected to their structures. The elastic strain field and tilt analysis of the crystal lattice, detectable by the variation in position and shape of the diffraction ...
S. Dolabella+3 more
semanticscholar +1 more source
Package Hermeticity Testing with Thermal Transient Measurements [PDF]
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments.
Rencz, M., Vass-Varnai, Andras
core +2 more sources
In this work, parametric investigations on structural optimization are systematically made for 4H-SiC-based separated absorption charge and multiplication (SACM) avalanche ultraviolet photodiode (UV APD).
Jianquan Kou+6 more
doaj +1 more source