Results 101 to 110 of about 2,052,774 (301)

A Simplified Laminar Flow Model for the Pultrusion of Glass Fiber/Polyethylene Terephthalate Commingled Yarns

Advanced Engineering Materials, EarlyView.
A simplified thermoplastic pultrusion model is developed to predict thermal fields in glass fiber/polyethylene terephthalate (GF/PET) composites with reduced computational cost. By combining effective material homogenization, validation against literature data, and Gaussian‐process‐based optimization, the study reveals how heating limits, pulling speed,
Elder Soares, Nadège Bouchonneau, Christian Jochum, Donald Radford   +3 more
wiley   +1 more source

Investigating the Effect of Inclination Angle and the Influence of Scan Parameters on the Appearance and Thermal and Mechanical Properties of Filigree Tension Rods of LPBF‐Manufactured NiTi Shape‐Memory Alloys

Advanced Engineering Materials, EarlyView.
This article investigates the dependence of the properties on the manufacturing orientation in the form of the inclination angle to the build plate of LPBF‐fabricated NiTi rods with a diameter of 150–220 µm. Metallographic, chemical, thermal, and mechanical characterization show behavior under identical manufacturing conditions that ranges from ...
Sandra Herzig, Michael Werner, Christian Rotsch   +2 more
wiley   +1 more source

Study on High-Density Integration Resistive Random Access Memory Array From Multiphysics Perspective by Parallel Computing

, 2019
Study on High-Density Integration Resistive Random Access Memory Array From Multiphysics Perspective by Parallel ...
Wang, Dawei, Xie, Hao, Gao, Pingqi, Zhao, Zhenguo, Yin, Wen-Yan, Zhu, Guodong, Chen, Wenchao, Schutt-Aine, Jose, Guodong Zhu, Wen-Yan Yin, Pingqi Gao, Dawei Wang, Jose Schutt-Aine, Zhenguo Zhao, Hao Xie, Wenchao Chen   +15 more
core   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

Memristor-Based Resistive Random Access Memory: Hybrid Architecture for Low Power Compact Memory Design [PDF]

, 2014
The computer memory system has both volatile and non volatile memory. The Volatile memories such as SRAM and DRAM used as a main memory and non volatile memory like flash memory.
V, Thangamani.
core   +1 more source

Optically and Electrically Controllable Light-Emitting Nonvolatile Resistive Switching Memory

Resistive switching memory (RSM) emerges as a decisive player for the future development of semiconductor industry due to its many advantages, such as high speed, cost effectiveness, excellent scalability, and compatibility with current technology ...
Yen-Yu Fu (14327820), Jia-Yu Lin (203339), Yang-Fang Chen (1437529)   +2 more
core   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Double-Forming Mechanism of TaO_x-Based Resistive Memory Device and Its Synaptic Applications. [PDF]

Materials (Basel), 2023
Ju D, Kim S, Lee S, Kim S.
europepmc   +1 more source

Dynamic conductance characteristics in HfO_x-based resistive random access memory

, 2017
Schematic of RESET analysis by dynamic conductance of I–V curve in HfOx-based resistive switching memory.
Jack C. Lee, Burt Fowler, Cheng-Chih Hsieh, Ying-Chen Chen, Fei Zhou, Ting-Chang Chang, Yao-Feng Chang, Chih-Yang Lin, Xiaohan Wu, Meiqi Guo   +9 more
core   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source