Results 251 to 260 of about 61,657 (284)

PostCMOS compatible sacrificial layers for aluminum nitride microcantilevers

Journal of Micro/Nanolithography, MEMS, and MOEMS, 2014
This report shows different fabrication procedures followed to obtain piezoelectric microcantilevers. The proposed microcantilever is a sandwich structure composed of chromium (Cr) electrodes (from 50 to 300-nm thick) and a reactive sputtered piezoelectric aluminum nitride (AlN) thin film (from 350 nm to 600-nm thick).
Ana Pérez-Campos, Gonzalo Fuentes Iriarte, Vadim Lebedev, Fernando Calle   +3 more
openaire   +1 more source

A sacrificial-layer approach to prepare microfiltration membranes

Journal of Membrane Science, 2008
The preparation of hydrophilic microfiltration membranes by a sacrificial layer via co-casting is reported in this paper. The membranes were fabricated using two polymer solutions. Selection of the sacrificial coating layer was based on solution blending between coating solution/PSf solution and co-casting of two solutions.
Li, X.M., Ji, Y., He, T., Wessling, M.
openaire   +2 more sources

A study on etching profiles of sacrificial layers

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004., 2005
Chemical etching of sacrificial layers is a widely used technique in surface micromachining. The causes of the triangle at the etch front are analyzed. The viewpoint that stress is the major factor of the triangle's formation is put forward. Through a study of the mechanism of the effects of annealing on etch rate, several rules about different ...
null WuChang-ju, null JmZhong-he, null MaHui-lian, null WmgYue-lin   +3 more
openaire   +1 more source

Micromachined sensors using polysilicon sacrificial layer etching technology

Proceedings of 1994 IEEE International Electron Devices Meeting, 2002
Sensor assembly is one of the key technologies to improve the cost performance of silicon sensors. As a technology to achieve this aim, polysilicon sacrificial layer etching technology is presented. As its applications, a microdiaphragm pressure sensor with a reference pressure chamber and an integrated pyroelectric infrared sensor with a thermal ...
S. Sugiyama, O. Tabata, K. Shimaoka, R. Asahi   +3 more
openaire   +1 more source

Compound sacrificial layer process for RF MEMS applications

2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009
Compound sacrificial layer has been developed for RF membrane bridge switch in micro electro mechanical systems (MEMS) tunable filters. The compound sacrificial layer consisting of polyimide and positive photoresist is used to avoid drawbacks which will occur when only polyimide or positive photoresist is used as sacrificial layer for suspended ...
Yong-hua Zhang, Chao Wang, Wei-xia Ouyang, Zong-sheng Lai   +3 more
openaire   +1 more source

A Novel Method of Removing Polyimide Sacrificial Layer

2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006
Due to the trade secrets and intellectual property, there are still many aspects of MEMS switches which are not understand well and are currently under investigation. In this paper, our report shows that MEMS can be released using O2 and a little carbon powder at the same time.
Xinglong Guo, Miao Cai, Lei Liu, Zongsheng Lai, Shouzheng Zhu   +4 more
openaire   +1 more source

Bulk silicon micromachining using porous silicon sacrificial layers

Microelectronic Engineering, 1997
Abstract A bulk silicon micromachining technique using porous silicon as a sacrificial layer is developed. The proposed process is fully C-MOS compatible and it was successfully used to fabricate deep cavities into silicon with very smooth bottom surfaces and sidewalls.
G. Kaltsas, A.G. Nassiopoulos
openaire   +1 more source

Silicon dioxide sacrificial layer etching in surface micromachining

Journal of Micromechanics and Microengineering, 1997
Silicon dioxide sacrificial layer etching has become a major surface micromachining method to fabricate microsensors and microactuators often made of polycrystalline silicon. An overview of the materials available in integrated circuit manufacturing is given, and the etch mechanism and sacrificial layer etch kinetics are reviewed.
J Bühler, F-P Steiner, H Baltes
openaire   +1 more source

Planarization of photoresist sacrificial layer for MEMS fabrication

Microelectronic Engineering, 2007
We describe a process to improve the planarization and the thermal stability of a polymeric sacrificial layer, which is used for the release of MEMS structures. This process involves a novolak matrix polymer. We show that the sacrificial layer topography critically depends on the process conditions, and we determine optimized methods based on a bi ...
Sofiane Soulimane, Fabrice Casset, Pierre-Louis Charvet, Catherine Maeder, Marc Aïd   +4 more
openaire   +1 more source

Application of porous silicon as a sacrificial layer

Sensors and Actuators A: Physical, 1994
Abstract Using porous silicon as a sacrificial layer a surface micromachining (SMM) process with a large distance from the structure to the substrate is realized. The application of this process for making free standing structures of polysilicon and flow channels is described.
W. Lang, P. Steiner, A. Richter, K. Marusczyk, G. Weimann, H. Sandmaier   +5 more
openaire   +1 more source