Results 121 to 130 of about 54,518 (263)
Computational Screening of Bonding-Controlled Electronic Structures in One-Dimensional Cu/Ag-Based Hybrid Semiconductors. [PDF]
Liu Z, Yang X, He X, Sun Y.
europepmc +1 more source
A 2D heterointerface with a two‐site anchor bridge suppresses nonradiative recombination at the perovskite/C₆₀ interface by reducing surface defects, elevating the Fermi level, and strengthening the electric field. This strategy enables efficient electron extraction, delivering 26.32% efficiency, 1.217 V Voc, excellent operational stability, and broad ...
Chaohui Li +27 more
wiley +1 more source
Computational and experimental pathways to next-generation ultrawide-band-gap oxide semiconductors. [PDF]
Chae S +5 more
europepmc +1 more source
High‐Throughput Exfoliation of Optoelectronic‐Grade MoS2 via Turbulent‐Flow Wet Jet Milling
A scalable wet jet milling exfoliation method is demonstrated for producing optoelectronic‐grade MoS2 nanosheets using environmentally friendly ethyl cellulose in ethanol dispersion media. Guided by fluid dynamics modeling, this approach is optimized to achieve record‐high exfoliation throughput and concentration.
Maryam Khalaj +7 more
wiley +1 more source
Precision Local Strain Engineering in 2D Semiconductors and Their van der Waals Heterostructures. [PDF]
Kim BC, Kim Y, Lee GH.
europepmc +1 more source
InSb, a narrow‐bandgap semiconductor with high carrier mobility, is promising for thermoelectric energy conversion but suffers from high lattice thermal conductivity and strong bipolar conduction. Here, in situ interface engineering using Co2O3 nanoprecursors forms hierarchical CoSbx/In2O3/CoSb3 heterostructures that enhance phonon scattering and ...
Jiwu Xin +10 more
wiley +1 more source
Full-Photolithographic High-Density Skin-Like Transistor Arrays for All-Organic Active-Matrix Displays. [PDF]
Xue P +17 more
europepmc +1 more source
Flexible piezoresistive pressure sensors underpin wearable and soft electronics. This review links sensing physics, including contact resistance modulation, quantum tunneling and percolation, to unified materials/structure design. We highlight composite and graded architectures, interfacial/porous engineering, and microstructured 3D conductive networks
Feng Luo +2 more
wiley +1 more source
Recent Progress in Gain Materials for Microlasers and Modern Digital Approaches for Biophotonics: From Dyes to Semiconductors. [PDF]
Calles-Arriaga CA +8 more
europepmc +1 more source

