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Skin-conformal PMN-PT ultrasonic sensor for cuffless blood pressure sensing via eutectic solder integration. [PDF]
Zaidi STH +5 more
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Enhanced Fringing Field Micro-Moisture Sensor with Elements Optimization. [PDF]
Meng X, Li C, Lan Y, Tan L, Zhang X.
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A low-cost and robust microscope hardware trigger interface board. [PDF]
Walker LA, Michki SN, Li Y, Cai D.
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Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]
Jeyeselan L, Mhd Noor EE.
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Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling. [PDF]
Zhao W +5 more
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Circuit World, 1977In the production of printed circuit assemblies, the demand for higher reliability levels has increased over the years. In order to achieve a high level of soldering quality, it is essential that solderability is built into the system at all stages and various factors must be taken into account.
M.L. Ackroyd, C.A. MacKay
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