Results 261 to 270 of about 27,052 (317)
Some of the next articles are maybe not open access.
Solderability and reliability evolution of no clean solder fluxes for selective soldering
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017Abstract Flux consumption for wave soldering tends to decrease, mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However, in several cases, wave soldering still remains a must, with an increasing share of “selective” soldering processes, either using wave frames with ...
Emmanuelle Guéné +2 more
openaire +2 more sources
SOLDERING WITH DUCTILE ACTIVE SOLDERS
Materials and Manufacturing Processes, 2001Ductile active solders enable production of the vacuum-tight joints of metals with such brittle nonmetallic materials as quartz, ceramics, silicon, and carbon. This article describes the techniques of the preparation of solders and the examples of the practical application of joints in the vacuum and cryogenic devices.
Jan Dupák, Vladimír Ustohal
openaire +1 more source
ACM SIGGRAPH 2003 video review on Animation theater program: part 1 - Volume 145, 2003
A story of creation, evolution and problem solving. After experiencing a problem with his creation, solder man looks to solve his dilemma the only way that he knows how, by soldering. With great effort he is successful, but finds himself in much worse shape.
openaire +1 more source
A story of creation, evolution and problem solving. After experiencing a problem with his creation, solder man looks to solve his dilemma the only way that he knows how, by soldering. With great effort he is successful, but finds himself in much worse shape.
openaire +1 more source
Solder bumping through Super Solder
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future', 2002Flip chip mounting technology is currently being considered for use in consumer information equipment, and industry is waiting for the establishment of solder bump forming technology as an essential constituent of flip chip (FC) mounting technology. At the present, however, no bump forming technology offers a combination of simple process and low cost.
Y. Kaga, T. Amano, M. Kohno, Y. Obara
openaire +1 more source
Impact of soldering terminal solderability of component and PCB on solder joint interface
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012The soldering terminal solderability of component and printed circuit board (PCB) has a strong impact on the formation of solder joint interface. The good solderability of the soldering terminal will result in good interface and high reliability of solder joint.
Yuming Wang +3 more
openaire +1 more source
Vacuum, 1964
Abstract A broad outline is presented of the physical principles that underline both soldering and brazing. The properties of the currently used materials are described, and examples are given of their practical application in the electronic industry.
openaire +1 more source
Abstract A broad outline is presented of the physical principles that underline both soldering and brazing. The properties of the currently used materials are described, and examples are given of their practical application in the electronic industry.
openaire +1 more source
Metallurgy of Soldering and Solderability
1989The solder used in electronic assembly serves to provide electrical and mechanical connections. In through-hole mount assemblies we had to worry primarily only about obtaining sound electrical connections, because the plated through holes imparted sufficient mechanical strength.
openaire +1 more source
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1994
Environmental issues have an ever‐increasing influence on the selection of material and processes in electronic manufacturing. This paper discusses the use of conductive adhesives as a replacement for solder on SMT printed circuit boards. As a result of a world‐wide market survey, a number of conductive adhesives have been selected.
openaire +1 more source
Environmental issues have an ever‐increasing influence on the selection of material and processes in electronic manufacturing. This paper discusses the use of conductive adhesives as a replacement for solder on SMT printed circuit boards. As a result of a world‐wide market survey, a number of conductive adhesives have been selected.
openaire +1 more source
Ageing, Solder Thickness and Solder Alloy Effects on Circuit Board Solderability
Circuit World, 1985The paper presents the results of extensive studies on circuit board solderability comparing wetting balance and IPC test methods through performance in vapour phase and wave soldering operations. The effects on solderability of key parameters are examined and compared with storage times of one year, and accelerated ageing using damp heat, dry heat and
J.K. Hagge, G.J. Davis
openaire +1 more source
Manufacturing Management, 2021
As part of Royal British Legion Industries, Scotland’s Bravest Manufacturing Company had to balance staff wellbeing with boosting production during the pandemic
openaire +1 more source
As part of Royal British Legion Industries, Scotland’s Bravest Manufacturing Company had to balance staff wellbeing with boosting production during the pandemic
openaire +1 more source