Results 281 to 290 of about 27,052 (317)
Some of the next articles are maybe not open access.
Tin–lead (SnPb) solder reaction in flip chip technology
Materials Science and Engineering Reports, 2001K N Tu
exaly
Thermomigration in solder joints
Materials Science and Engineering Reports, 2012Chih Chen, Hsiang-Yao Hsiao, K N Tu
exaly
Solders and soldered joints in thermal cycling
Chemical and Petroleum Engineering, 1979E. I. Ardashnikova +2 more
openaire +1 more source
Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests
Journal of Alloys and Compounds, 2020Choong-Jae Lee +2 more
exaly

