Results 281 to 290 of about 27,052 (317)
Some of the next articles are maybe not open access.

Tin–lead (SnPb) solder reaction in flip chip technology

Materials Science and Engineering Reports, 2001
K N Tu
exaly  

Thermomigration in solder joints

Materials Science and Engineering Reports, 2012
Chih Chen, Hsiang-Yao Hsiao, K N Tu
exaly  

Solders and soldered joints in thermal cycling

Chemical and Petroleum Engineering, 1979
E. I. Ardashnikova   +2 more
openaire   +1 more source

Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Journal of Alloys and Compounds, 2020
Choong-Jae Lee   +2 more
exaly  

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