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Proposed Numerical Evaluation System for Soft Solders, Solder Fluxes, and Solderability
1957In the numerical evaluation system described in this paper, the nominal diameter of a sphere formed by a standardized solder specimen provides the zero per cent mark; the infinite thinness of the same solder mass spread as a film provides the 100 per cent mark, on a percentage scale.
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2017
<div class="section abstract"> <div class="htmlview paragraph">The choice of the type and grade of solder for any specific purpose will depend on the materials to be joined and the method of applying. Those with higher amounts of tin usually wet and bond more readily and have a narrower semi-molten range than lower amounts of tin.</div&
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<div class="section abstract"> <div class="htmlview paragraph">The choice of the type and grade of solder for any specific purpose will depend on the materials to be joined and the method of applying. Those with higher amounts of tin usually wet and bond more readily and have a narrower semi-molten range than lower amounts of tin.</div&
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Soldering Faults—Inspection of Solder Connections
Abstract This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection, ultrasonic testing, radiographic examination, dyeopenaire +1 more source
Soldering of Metals and the Preparation of Solders and Soldering Agents
Scientific American, 1904openaire +1 more source
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Materials Science and Engineering Reports, 2002K N Tu
exaly