Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits. [PDF]
Qin L, Wang L.
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68-channel neural signal processing system-on-chip with integrated feature extraction, compression, and hardware accelerators for neuroprosthetics in 22 nm FDSOI. [PDF]
Guo L +15 more
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Advanced Design for High-Performance and AI Chips. [PDF]
Cao Y, Chen Y, Fan X, Fu H, Xu B.
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What is next for LLMs? Pushing the boundaries of next-gen AI computing hardware with photonic chips. [PDF]
Li R +9 more
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Relay Protection Device Reliability Assessment Through Radiation, Fault Injection and Fault Tree Analysis. [PDF]
Zhou H +6 more
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Wafer-scale fabrication of memristive passive crossbar circuits for brain-scale neuromorphic computing. [PDF]
Choi S +4 more
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A Survey of Emerging Memory in a Microcontroller Unit. [PDF]
Qi L, Fan J, Cai H, Fang Z.
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Progress on a Carbon Nanotube Field-Effect Transistor Integrated Circuit: State of the Art, Challenges, and Evolution. [PDF]
Chen Z +5 more
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Inverse Lithography Technology (ILT) Under Chip Manufacture Context. [PDF]
Meng X, Chen C, Ni J.
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