Results 131 to 140 of about 322 (148)
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An improved transmission line pulsing (TLP) setup for electrostatic discharge (ESD) testing in semiconductor devices and ICs

ICMTS 2001. Proceedings of the 2001 International Conference on Microelectronic Test Structures (Cat. No.01CH37153), 2002
Transmission line pulsing (TLP) is a useful technique to characterize electrostatic discharge (ESD) events in semiconductor devices. The pulse waveforms generated by a typical TLP set-up, however, are often distorted and oscillatory. In this paper, a new and simple experimental set-up is developed to improve the shape of the TLP waveforms and thus to ...
J.C. Lee   +4 more
openaire   +1 more source

Correlation limits between capacitively coupled transmission line pulsing (CC-TLP) and CDM for a large chip-on-flex assembly

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2017
For the first time this correlation study compares air discharge CDM and contact-mode Capacitively Coupled Transmission Line Pulsing (CC-TLP) for a large chip-on-flex assembly e.g. for the Internet of Things (IOT) applications. Both ground planes overlap only part of the flexible substrate with long traces.
Johannes Weber   +4 more
openaire   +1 more source

High current transmission line pulse (TLP) and ESD characterization of a silicon germanium heterojunction bipolar transistor with carbon incorporation

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320), 2003
Electrostatic discharge robustness of an epitaxial-base pseudomorphic Silicon Germanium Heterojunction Bipolar Transistor (HBT) device with Carbon incorporation is shown for the first time. Experimental results show that incorporation of Carbon in the base of a SiGe HBT device improves power-to-failure variation by improved control of the base width ...
B. Ronan   +5 more
openaire   +1 more source

Correlation Between TLP, HMM, and System-Level ESD Pulses for Cu Metallization

IEEE Transactions on Device and Materials Reliability, 2014
J Liou
exaly  

ESD On-Wafer Characterization: Is TLP Still the Right Measurement Tool?

IEEE Transactions on Instrumentation and Measurement, 2009
Mirko Scholz, Dimitri Linten, S Thijs
exaly  

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