Results 51 to 60 of about 80,250 (296)

Tailored Hierarchical Porous Copper Architectures via Three Dimensional Printing and Pressure‐less Sintering for Next‐Generation Lithium‐Metal Batteries

open access: yesAdvanced Engineering Materials, EarlyView.
A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley   +1 more source

Wet Etching

open access: yesJournal of The Surface Finishing Society of Japan
Citation: 'wet etching' in the IUPAC Compendium of Chemical Terminology, 5th ed.; International Union of Pure and Applied Chemistry; 2025. Online version 5.0.0, 2025. 10.1351/goldbook.09491 • License: The IUPAC Gold Book is licensed under Creative Commons Attribution-ShareAlike CC BY-SA 4.0 International for individual terms ...
openaire   +2 more sources

High speed silicon wet anisotropic etching for applications in bulk micromachining: a review

open access: yesMicro and Nano Systems Letters, 2021
Wet anisotropic etching is extensively employed in silicon bulk micromachining to fabricate microstructures for various applications in the field of microelectromechanical systems (MEMS).
Prem Pal   +5 more
doaj   +1 more source

AlN/GaN-based MOS-HEMT technology: processing and device results [PDF]

open access: yes, 2011
Process development of AlN/GaN MOS-HEMTs is presented, along with issues and problems concerning the fabrication processes. The developed technology uses thermally grown Al<sub>2</sub>O<sub>3</sub> as a gate dielectric and surface
MacFarlane, D., Taking, S., Wasige, E.
core   +3 more sources

Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland   +5 more
wiley   +1 more source

Research of selective etching in LiNbO3 using proton-exchanged wet etching technique

open access: yesMaterials Research Express, 2020
Lithium niobate material (LN) has shown great application potentials in the fabrication of integrated optical devices due to its excellent physical properties, especially with the occurrence of lithium niobate-on-insulator (LNOI) substrate.
Ying Li   +6 more
doaj   +1 more source

Al–Cu Composite Casting of Laser‐Deoxidized Copper: Bonding, Interfacial Chemistry, and Thermal Conductivity

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff   +9 more
wiley   +1 more source

Thickness control in electrogenerated mesoporous silica films by wet etching and electrochemical monitoring of the process

open access: yesElectrochemistry Communications, 2019
Vertically aligned mesoporous silica films can be generated by electrochemically assisted self-assembly (EASA) but the accurate control of their thickness is essentially restricted to the 100 nm range.
Taisiia Sikolenko   +3 more
doaj   +1 more source

Laser-induced microexplosion confined in a bulk of silica: formation of nanovoids [PDF]

open access: yes, 2016
We report on the nanovoid formation inside synthetic silica, viosil, by single femtosecond pulses of 30–100nJ energy, 800nm wavelength, and 180fs duration.
Gamaly, Eugene G   +4 more
core   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

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