Results 41 to 50 of about 23,327 (300)

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Micromachines, 2020
To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone.
Tieying Ma, Jiachen Wang, Dabo Li
doaj   +1 more source

Innovative Processing of Compacted Waste Aluminum Alloy Powders via Controlled Remelting and Solidification

Advanced Engineering Materials, EarlyView.
This study demonstrates an efficient recycling route for out‐of‐spec AlSi10Mg atomized powders through compaction and arc remelting followed by suction casting. By correlating compaction load, cooling rate, and resulting microstructure, we show that intermediate pressures (50–80 kN) and rapid cooling refine dendrites, reduce porosity, and enhance ...
Mila Christy de Oliveira, Marcella Gaute Cavalcante Xavier, Abdoul‐Aziz Bogno, Piter Gargarella, José Eduardo Spinelli   +4 more
wiley   +1 more source

Tailored Hierarchical Porous Copper Architectures via Three Dimensional Printing and Pressure‐less Sintering for Next‐Generation Lithium‐Metal Batteries

Advanced Engineering Materials, EarlyView.
A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley   +1 more source

Black Silicon Obtained in Two-Step Short Wet Etching as a Texture for Silicon Solar Cells – Surface Microstructure and Optical Properties Studies [PDF]

Archives of Metallurgy and Materials, 2018
In this study a two-step short wet etching was implemented for the black silicon formation. The proposed structure consists of two steps. The first step: wet acidic etched pits-like morphology with a quite new solution of lowering the texturization ...
G. Kulesza-Matlak, K. Gawlińska, Z. Starowicz, A. Sypień, K. Drabczyk, B. Drabczyk, M. Lipiński, P. Zięba   +7 more
doaj   +1 more source

Near‐Field Electrospinning Micro‐Printhead Achieves Precise Control of Nanofiber Deposition

Advanced Engineering Materials, EarlyView.
A micro‐printhead for near‐field electrospinning enables reproducible deposition of polymer nanofibers with diameters below 50 nm. Systematic parameter studies uncover the mechanisms linking operating conditions to fiber morphology, paving the way for precise and low‐cost nanoscale 3D manufacturing.As a high‐resolution, cost‐effective, and rapid ...
Han Xu, Dario Mager, Jan G. Korvink
wiley   +1 more source

Research of selective etching in LiNbO3 using proton-exchanged wet etching technique

Materials Research Express, 2020
Lithium niobate material (LN) has shown great application potentials in the fabrication of integrated optical devices due to its excellent physical properties, especially with the occurrence of lithium niobate-on-insulator (LNOI) substrate.
Ying Li, Tian Lan, Dengcai Yang, Meihua Xiang, Jingjing Dai, Chong Li, Zhiyong Wang   +6 more
doaj   +1 more source

High speed silicon wet anisotropic etching for applications in bulk micromachining: a review

Micro and Nano Systems Letters, 2021
Wet anisotropic etching is extensively employed in silicon bulk micromachining to fabricate microstructures for various applications in the field of microelectromechanical systems (MEMS).
Prem Pal, Veerla Swarnalatha, Avvaru Venkata Narasimha Rao, Ashok Kumar Pandey, Hiroshi Tanaka, Kazuo Sato   +5 more
doaj   +1 more source

Gate recess engineering of pseudomorphic In0.30GaAs/GaAs HEMTs [PDF]

, 1996
The authors report how the performance of 0.12 μm GaAs pHEMTs is improved by controlling both the gate recess width, using selective dry etching, and the gate position in the source drain gap, using electron beam lithography.
Taylor, M.R.S., Holland, M.C., Beaumont, S.P., Asenov, A., Cameron, N.I., Murad, S., McLelland, H.   +6 more
core  

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source

wet etching

Journal of The Surface Finishing Society of Japan
Citation: 'wet etching' in the IUPAC Compendium of Chemical Terminology, 5th ed.; International Union of Pure and Applied Chemistry; 2025. Online version 5.0.0, 2025. 10.1351/goldbook.09491 • License: The IUPAC Gold Book is licensed under Creative Commons Attribution-ShareAlike CC BY-SA 4.0 International for individual terms ...
openaire   +2 more sources