Results 41 to 50 of about 2,052 (205)
Advanced Engineering Materials, EarlyView.Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich +3 more
wiley +1 more source
Fostering Innovation: Streamlining Magnetocaloric Materials Research by Digitalization
Advanced Engineering Materials, EarlyView.Magnetocaloric cooling (MCE) is an environmentally friendly refrigeration method with great potential. Optimizing MCE materials involves the preparation and screening of large quantities of samples, which in turn generates a large amount of data. A digitalization approach is presented that uses ontologies, knowledge graphs, and digital workflows to ...
Simon Bekemeier +17 more
wiley +1 more source
The PRIMA Thesaurus for Materials Science and Engineering
Advanced Engineering Materials, EarlyView.The PRIMA Thesaurus is a structured vocabulary designed to improve how materials science data is described and shared. Developed with input from multiple experts, it enables clear documentation of research workflows, data exchange, and reuse across platforms.
Rossella Aversa +8 more
wiley +1 more source
Atomic layer processing for Ångström-scale precision in 3D-integrated semiconductor manufacturing
International Journal of Extreme ManufacturingFor decades, conventional geometric scaling has driven performance improvements in the semiconductor industry. However, the continued reduction in technology nodes has increasingly become decoupled from simple dimensional shrinkage, instead reflecting ...
Hae Lin Yang +7 more
doaj +1 more source
Preventing unwanted atomic layer deposition by liquid sealing
Nano TrendsAtomic layer deposition (ALD) is an essential thin film fabrication technique widely used in electronic and energy systems, but avoiding ALD in untargeted areas has been a long-standing challenge that excludes the possibility of creating patterns through
Haochuan Wang +10 more
doaj +1 more source
Application of atomic layer deposition in nanophotonics [PDF]
SPIE Proceedings, 2014 We review our recent results on using Atomic Layer Deposition (ALD) in fabrication of nanophotonic waveguide devices. ALD is a unique thin film deposition method providing atomic level control of film composition and thickness, perfect step coverage, and large-area uniformity. We employ the advantages of ALD in connection with Sinanophotonics.
Kuittinen Markku +5 more
openaire +4 more sources
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
Advanced Engineering Materials, EarlyView.A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy
Advanced Engineering Materials, EarlyView.A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang +10 more
wiley +1 more source
Atomic Layer Deposition of Boron‐Doped Al2O3 Dielectric Films
Advanced Materials Interfaces, 2023 This paper presents preparation of boron‐doped Al2O3 thin films by atomic layer deposition (ALD) using phenylboronic acid (PBA) and trimethylaluminum (TMA) as precursors.
Xinzhi Li +7 more
doaj +1 more source