Results 81 to 90 of about 86,737 (303)

Affecting the Properties of Copper–Graphene Electroconductive Composite by Severe Plastic Deformation

open access: yesAdvanced Engineering Materials, EarlyView.
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich   +3 more
wiley   +1 more source

Atomic Layer Deposition of Molybdenum Carbide Thin Films

open access: yesAdvanced Materials Interfaces
The development of deposition processes for metal carbide thin films is rapidly advancing, driven by their potential for applications including catalysis, batteries, and semiconductor devices.
Paloma Ruiz Kärkkäinen   +16 more
doaj   +1 more source

Research status and development trend of area selective atomic layer deposition

open access: yesGongneng cailiao yu qijian xuebao
In recent years, with manufacturing technology advancing into the atomic age, significant progress has been achieved in nano-manufacturing technologies.
Xiaorui WU   +4 more
doaj   +1 more source

Atomic Layer Deposition of ZrO2 on Titanium Inhibits Bacterial Adhesion and Enhances Osteoblast Viability

open access: yesInternational Journal of Nanomedicine, 2021
Yujin Jo,1 Yong Tae Kim,2 Hoonsung Cho,2 Min-Kyung Ji,3 Jaeyeong Heo,2,3 Hyun-Pil Lim1 1Department of Prosthodontics, School of Dentistry, Chonnam National University, Gwangju, Korea; 2Department of Materials Science and Engineering, Chonnam National ...
Jo Y   +5 more
doaj  

Fostering Innovation: Streamlining Magnetocaloric Materials Research by Digitalization

open access: yesAdvanced Engineering Materials, EarlyView.
Magnetocaloric cooling (MCE) is an environmentally friendly refrigeration method with great potential. Optimizing MCE materials involves the preparation and screening of large quantities of samples, which in turn generates a large amount of data. A digitalization approach is presented that uses ontologies, knowledge graphs, and digital workflows to ...
Simon Bekemeier   +17 more
wiley   +1 more source

Tunable Plasmonic Colours by Atomic Layer Deposition of Alumina

open access: yes, 2018
We report the tuning of plasmonic colours on silver by controlling the thickness of alumina films deposited via atomic layer deposition. The colours are observed to shift with increasing alumina film thickness.
Choloong, Hahn   +8 more
core   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

The Use of Feature Parameters to Asses Barrier Properties of ALD coatings for Flexible PV Substrates

open access: yes, 2014
This paper reports on the recent work carried out as part of the EU funded NanoMend project. The project seeks to develop integrated process inspection, cleaning, repair and control systems for nano-scale thin films on large area substrates.
Robbins, David   +3 more
core   +1 more source

Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy

open access: yesAdvanced Engineering Materials, EarlyView.
A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang   +10 more
wiley   +1 more source

Detailed study of copper oxide ALD on SiO2, TaN, and Ru

open access: yes, 2022
1 S.Copper films with a thickness in the nanometer range are required as seed layers for the electrochemical Cu deposition to form multilevel interconnects in ultralarge-scale integrated (ULSI) electronic devices. Continuously shrinking device dimensions
Roth, N.   +8 more
core  

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