Results 11 to 20 of about 2,709,660 (260)
We studied the reverse current emission mechanism of the Mo/β-Ga2O3 Schottky barrier diode through the temperature-dependent current-voltage (I-V) characteristics from 298 to 423 K.
Zhuangzhuang Hu +10 more
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In this work, we report on demonstrating lateral β-Ga2O3 Schottky barrier diodes (SBDs) fabricated on Fe-GaN/sapphire (0001) substrates by using the non-vacuum, low-cost mist chemical vapor deposition (mist CVD) method for the first time.
Yu Xu +10 more
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Memristor-Based Signal Processing for Compressed Sensing
With the rapid progress of artificial intelligence, various perception networks were constructed to enable Internet of Things (IoT) applications, thereby imposing formidable challenges to communication bandwidth and information security.
Rui Wang +6 more
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Simultaneous Existence of Phononic and Photonic Band Gaps in Phoxonic Crystal Slabs [PDF]
We discuss the simultaneous existence of phononic and photonic band gaps in a periodic array of holes drilled in a Si membrane. We investigate in detail both the centered square lattice and the boron nitride (BN) lattice with two atoms per unit cell ...
Papanikolaou, N. +30 more
core +1 more source
Flexible ITO-Free Organic Solar Cells Based on
Flexible organic solar cells (OSCs) using our proposed MoO3 (2 nm)/Ag (9 nm) anode are fabricated on poly(ethylene terephthalate) (PET) substrates with poly(3hexylthiophene) (P3HT) and [6,6]-phenyl-C61 -butyric acid methyl ester (PCBM) films as the ...
Zhizhe Wang +8 more
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All-inorganic carbon-based CsPbIBr2 perovskite solar cells (PSCs) have attracted increasing interest due to the low cost and the balance between bandgap and stability.
Wensheng Lan +11 more
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FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer.
Garuma Abdisa Denu +4 more
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Through‐silicon via (TSV) technology is a key technology to realize multi‐layer chips and its structure model and transmission characteristics have attracted much attention.
Wenbo Guan +3 more
doaj +1 more source
In this paper, a novel silicon carbide (SiC) trench metal oxide semiconductor field effect transistor (MOSFET) with improved reverse recovery charge and switching energy loss is proposed and investigated utilising ISE‐TCAD simulations.
Sicheng Liu +6 more
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Ge pMOSFETs with GeO x Passivation Formed by Ozone and Plasma Post Oxidation
A comparison study on electrical performance of Ge pMOSFETs with a GeO x passivation layer formed by ozone post oxidation (OPO) and plasma post oxidation (PPO) is performed. PPO and OPO were carried out on an Al2O3/n-Ge (001) substrate followed by a 5-nm
Yang Xu +6 more
doaj +1 more source

