Results 21 to 30 of about 198,063 (268)
Flexible ITO-Free Organic Solar Cells Based on
Flexible organic solar cells (OSCs) using our proposed MoO3 (2 nm)/Ag (9 nm) anode are fabricated on poly(ethylene terephthalate) (PET) substrates with poly(3hexylthiophene) (P3HT) and [6,6]-phenyl-C61 -butyric acid methyl ester (PCBM) films as the ...
Zhizhe Wang +8 more
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Distinct band gaps and isotropy combined in icosahedral band gap materials [PDF]
Icosahedral band gap materials (BGMs) optimally combine the distinct band gaps of periodic BGMs with the high rotational symmetry of quasiperiodic structures. This is shown experimentally for longitudinal and transverse polarized elastic waves in a phononic crystal based on the three-dimensional Penrose tiling (3D-PT) and applies equally to photonic ...
Sutter-Widmer, D. +4 more
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FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer.
Garuma Abdisa Denu +4 more
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Silicon Nanowire Band Gap Modification [PDF]
Band gap modification for small-diameter (1 nm) silicon nanowires resulting from the use of different species for surface termination is investigated by density functional theory calculations. Because of quantum confinement, small-diameter wires exhibit a direct band gap that increases as the wire diameter narrows, irrespective of surface termination ...
Nolan, Michael +4 more
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Ge pMOSFETs with GeO x Passivation Formed by Ozone and Plasma Post Oxidation
A comparison study on electrical performance of Ge pMOSFETs with a GeO x passivation layer formed by ozone post oxidation (OPO) and plasma post oxidation (PPO) is performed. PPO and OPO were carried out on an Al2O3/n-Ge (001) substrate followed by a 5-nm
Yang Xu +6 more
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Effect of thermoelastic damping on silicon, GaAs, diamond and SiC micromechanical resonators
The effect of thermoelastic damping as a main dissipation mechanism in single crystalline silicon, GaAs, diamond, SiC and SiO2 micromechanical resonators are studied.
Garuma Abdisa Denu +4 more
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Through‐silicon via (TSV) technology is a key technology to realize multi‐layer chips and its structure model and transmission characteristics have attracted much attention.
Wenbo Guan +3 more
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Lithographic band gap tuning in photonic band gap crystals
We describe the lithographic control over the spectral response of three-dimensional photonic crystals. By precise microfabrication of the geometry using a reproducible and reliable procedure consisting of electron beam lithography followed by dry etching, we have shifted the conduction band of crystals within the near-infrared.
Cheng, C. C. +3 more
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Creation of partial band gaps in anisotropic photonic-band-gap structures [PDF]
The photonic-band-gap (PBG) structure composed of an anisotropic-dielectric sphere in uniform dielectric medium is studied by solving Maxwell's equations using the plane-wave expansion method. In particular, for a uniaxial material with large principal refractive indices and sufficient anisotropy between them, the photonic band structures possess a ...
Li, ZY, Gu, BY, Wang, J
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Creating Band Gaps in Periodic Media [PDF]
We identify explicit conditions on geometry and material contrast for creating band gaps in 2-d photonic and 3-d acoustic crystals. This approach is novel and makes use of the electro-static and quasi-periodic source free resonances of the crystal.
Robert Lipton 0001, Robert Viator Jr.
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