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High-Density Board Fabrication Techniques
IBM Journal of Research and Development, 1982A variety of construction methods can be used to form high-density printed-circuit boards. The electrical and mechanical requirements of a design strongly influence the choice of process used to produce the finished product. The introduction of physically large high-density boards required the development of many new processes, several of which are ...
J. R. Bupp +3 more
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High-density, high speed, board-to-board stripline connector
40th Conference Proceedings on Electronic Components and Technology, 2002The AMP Mini-TBC stripline connector is described. This connector embodies a concept which approaches homogeneity across the connection of two printed circuit cards. Stripline characteristics of the board are maintained through the connector and make the connector virtually transparent to the circuit.
M.M. Sucheski, D.W. Glover
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High density multilayer printed wiring boards
1979 EIC 14th Electrical/Electronics Insulation Conference, 1979This paper describes an alternative fabrication technique which provides multilayer printed wiring boards having higher interconnection density, lower weight, smaller size and better heat transfer than conventional multilayer boards. These benefits are obtained by laminating thin, interconnected, two-sided circuits to form the multilayer circuit board.
Gerald Boucher, Daniel Holland
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High Density Metal Core Printed Circuit Boards
Circuit World, 1981To solve the problems associated with heat generation as packaging density increases, especially with the use of VSLI devices, high density metal core PCBs have been developed. The manufacturing process is evaluated alongside that of conventional G‐10 boards, as are the electrical properties of the two types.
G. Morisaki, T. Sato, H. Kikuchi
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On-board SRAM signal density stress prediction
SPIE Proceedings, 2006Static Random Access Memory (SRAM) chips undergo several types of stress in the field. Existing work has concentrated primarily on humidity and thermal stress; there has been relatively little emphasis on signal density stress prediction. Objectives of this study were to (1) explore the impact of signal density stress on SRAM functionality, (2 ...
Sheng-Jen Hsieh, Kartik Sharma
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High‐density wiring technology in multiwire boards
Electronics and Communications in Japan (Part II: Electronics), 1989AbstractThis paper considers the recent requirement for high‐density packaging technology and discusses the high‐density wiring technique for the Multiwire board. A proposal is made for the wiring rule as well as the fundamental manufacturing processes, which can realize twice higher wiring density compared with the traditional method.
Naoki Fukutomi +5 more
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High-density build-up wiring boards using conventional printed wiring boards process
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future', 2002To keep pace with the downsizing of electronic communication equipment and acceleration of transmission speed, the printed wiring board (PWB) must have finer wiring and thinner plating. While various means have been developed to produce these high density boards, we have also developed a process that enables the production of upper and lower surface ...
S. Itaya +6 more
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High density multilayer optical circuit board for unprecedented connectivity at board scales
2016 IEEE International Conference on Rebooting Computing (ICRC), 2016We present a new optical interconnect platform consisting of a multilayer integrated optical circuit board which provides unprecedented communications capacity with minimal signal loss at circuit board scales. The enhancement in spatial communication density could reduce the size of large distributed systems by up to two orders of magnitude (and hence ...
Andrew Michaels, Eli Yablonovitch
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A high power-density DC-DC converter board
1987 2nd IEEE Applied Power Electronics Conference and Exposition, 1987A series of multiple output, 500 Watt, dc-dc converter boards for use in a 3kW computer power system is described. High power-density (9 Watts/cu.in. including heatsinks) is achieved through the use of thick film hybrid modules and a 316kHz switching frequency. The system considerations, design tradeoffs, and problems encountered are described.
John Kociecki +2 more
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Utilization of wastepaper to manufacture low density boards
Bioresource Technology, 2000Abstract Shredded newspaper, magazine, and office wastepaper, bonded with urea-formaldehyde (UF) and tannin paraformaldehyde (TP) adhesives both at 8% and 12% of resin solid contents, based on oven-dried weight of particles, were used to produce low-density boards in a series of laboratory scale experiments.
Esmeralda Yoshico Arakaki Okino +2 more
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