Results 61 to 70 of about 582,324 (168)

The impact of density and mixture ratio of melamine on some properties of oriented strand board

open access: yesMaderas: Ciencia y Tecnología, 2018
The aim of this study is to determine the effects of density and melamine rate on thickness swelling, moisture resistance, modulus of elasticity in bending, bending strength and tensile strength of Oriented Strand Board.
Mehmet Hakan Akyildiz   +2 more
doaj  

Design and Shielding Effect Test of Antimagnetic Plate Based on Air-cored Reactor for Metro Vehicles

open access: yes机车电传动, 2019
Leakage magnetic field generated by the air-cored reactor will produce electromagnetic pollution in the metro system, therefore, magnetic shielding of the antimagnetic plate is of crucial importance.
Qing TIAN, Yong WANG, Gang LYU
doaj  

Potential of using recycled low-density polyethylene in wood composites board

open access: yesAfrican Journal of Environmental Science and Technology, 2011
The aim of this study was to investigate the suitability of using recycled low density polyethylene (RLDPE) in wood board manufacturing. The composite board was produced by compressive moulding by increasing the percentage of LDPE from 30 to 50 wt% with interval of 10 wt% at a temperatures of 140 and 180°C, pressure of 30 to 40 Kg/cm² and ...
A. C. Igboanugo   +2 more
openaire   +2 more sources

Corrigendum to ‘Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery’ [J Mater Res Technol 30 (2024) 3831–3839]

open access: yesJournal of Materials Research and Technology
Yijun Wu   +11 more
doaj   +1 more source

Preparation and Properties of a Rigid Hemp Shiv Insulation Particle Board Using Citric Acid-Glycerol Mixture as an Eco-Friendly Binder

open access: yesBioResources
Particle boards are commonly manufactured from wood-based material bound with a thermosetting adhesive based on the reaction of formaldehyde with phenol, urea, melamine, or co-condensates. The use of formaldehyde is a cause for concern due to its harmful
Simon Pépin   +2 more
doaj  

Technology of High Density Build-up Wiring Board.

open access: yesJournal of SHM, 1996
Satoshi Itaya, Hideki Miyazawa
openaire   +2 more sources

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