Results 241 to 250 of about 32,799 (288)

Urgent endoscopic submucosal dissection of an obstructing, bleeding giant duodenal "Brunneroma". [PDF]

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Kalopitas G, Bosch EM, Rimondi A, Planche K, Gulotta M, Murino A, Despott EJ.   +6 more
europepmc   +1 more source

Magnetoresistance governs apparent magnetic-field enhancements in water electrolysis

Baeumer C, Ratovskii V, Minne Evd, Gossing F, McCord J, Koster G, Bosch Ivd, Ruiters J, Wielens D, Verhage M.   +9 more
europepmc   +1 more source

Cross-section control of stacked nanowires formed by Bosch process and oxidation

2010 3rd International Nanoelectronics Conference (INEC), 2010
The cross-sectional shape of the stacked silicon nanowires (SiNWs) formed by the Bosch process and stress-limited oxidation is studied in this paper. Under the condition of high temperature oxidation, the resulting nanowires highly resemble the initial shapes resulting by the Bosch process.
Mansun Chan
exaly   +5 more sources

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Simulation of the Bosch process for micro- and nanostructures

Russian Microelectronics, 2015
This paper describes the capabilities of the Bosch process simulation for microand nanostructures with the aid of NEMO ETCHING software. The heart of this program is an original hybrid algorithm, which is based on the Monte–Carlo method and on the cell-graph approximation of the string model.
P E Troyan
exaly   +2 more sources

Parameter study for silicon grass formation in Bosch process

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, 2010
Bosch process is one type of silicon etching technology for high-aspect ratio where silicon grass is one of the by-products. Previously, most of the studies have been focused on eliminating these silicon grasses. However, in this study, the optimized condition for obtaining silicon grasses was studied using inductively coupled plasma reactive ion ...
Woojin Song, Caroline Sunyong Lee, Lee Caroline Sunyong   +2 more
exaly   +2 more sources

Improving sidewall roughness by combined RIE-Bosch process

Materials Science in Semiconductor Processing, 2018
Abstract An approach for improving sidewall roughness of high-aspect-ratio trench is developed. This method relies on the aspect ratio dependent scalloping attenuation (ARDSA) effect in Bosch process, employs reactive ion etching (RIE) process to avoid the rippled sidewall at the top of the trench, while retains Bosch process with increasing trench ...
Jiahan Yu, Wenwu Wang
exaly   +2 more sources

Bosch Process Characterization for Donut TSV’S

Wafer-Level Packaging Symposium, 2014
ABSTRACT In a continuous quest for cost reduction, the semiconductor industry continues to pursue device scaling techniques. However as scaling becomes more complex and expensive, alternative techniques for cost reduction are being investigated.
John Slabbekoorn, Bart Schepers, Khashayar Babaei Gavan, Stefano Sardo, Stefaan Van Huylenbroeck, Tom Vandeweyer, Andy Miller, Kenneth June Rebibis, Warren W. Flack, Robert Hsieh, Manish Ranjan   +10 more
openaire   +1 more source

The Relevance of Internal Communication in Innovation Processes: The Bosch Case Study

2021
Technology, innovation and communication are three interconnected phenomena with great relevance for contemporary companies that caught the attention of Organizational Communication theorists. To expand knowledge on this topic, an action-research was developed in the project management department of a Bosch factory in Portugal.
Teresa Ruão, Sandra Marinho, Sónia Silva   +2 more
openaire   +2 more sources