Results 251 to 260 of about 266,768 (294)

Parameter study for silicon grass formation in Bosch process

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, 2010
Bosch process is one type of silicon etching technology for high-aspect ratio where silicon grass is one of the by-products. Previously, most of the studies have been focused on eliminating these silicon grasses. However, in this study, the optimized condition for obtaining silicon grasses was studied using inductively coupled plasma reactive ion ...
Woojin Song
exaly   +2 more sources

Improving sidewall roughness by combined RIE-Bosch process

Materials Science in Semiconductor Processing, 2018
Abstract An approach for improving sidewall roughness of high-aspect-ratio trench is developed. This method relies on the aspect ratio dependent scalloping attenuation (ARDSA) effect in Bosch process, employs reactive ion etching (RIE) process to avoid the rippled sidewall at the top of the trench, while retains Bosch process with increasing trench ...
Jianyu Fu, Junjie Li, Jiahan Yu, Ruiwen Liu, Junfeng Li, Weibing Wang, Wenwu Wang, Dapeng Chen   +7 more
exaly   +2 more sources

Cross-section control of stacked nanowires formed by Bosch process and oxidation

2010 3rd International Nanoelectronics Conference (INEC), 2010
The cross-sectional shape of the stacked silicon nanowires (SiNWs) formed by the Bosch process and stress-limited oxidation is studied in this paper. Under the condition of high temperature oxidation, the resulting nanowires highly resemble the initial shapes resulting by the Bosch process.
Xuan, Zuo, Tao, Wang, Ricky M Y, Ng, Jin, He, Mansun, Chan   +4 more
exaly   +3 more sources

Bosch Process Characterization for Donut TSV’S

Wafer-Level Packaging Symposium, 2014
ABSTRACT In a continuous quest for cost reduction, the semiconductor industry continues to pursue device scaling techniques. However as scaling becomes more complex and expensive, alternative techniques for cost reduction are being investigated.
John Slabbekoorn, Bart Schepers, Khashayar Babaei Gavan, Stefano Sardo, Stefaan Van Huylenbroeck, Tom Vandeweyer, Andy Miller, Kenneth June Rebibis, Warren W. Flack, Robert Hsieh, Manish Ranjan   +10 more
openaire   +1 more source

Optimization of the Bosch CO2 Reduction Process

SAE Technical Paper Series, 1991
<div class="htmlview paragraph">Extensive development testing to support the design of the Space Station Freedom (SSF) Carbon Dioxide (CO₂) Reduction Assembly (CReA) has been conducted. Both dual and single reactor eight-person capacity systems, supported by experimental test setups, have been used to broaden the design ...
Charles T. Bunnell, Robert B. Boyda, M. G. Lee   +2 more
openaire   +1 more source

The Relevance of Internal Communication in Innovation Processes: The Bosch Case Study

2021
Technology, innovation and communication are three interconnected phenomena with great relevance for contemporary companies that caught the attention of Organizational Communication theorists. To expand knowledge on this topic, an action-research was developed in the project management department of a Bosch factory in Portugal.
Teresa Ruão, Sandra Marinho, Sónia Silva   +2 more
openaire   +2 more sources

Shrinking the Haber-Bosch process

C&EN Global Enterprise, 2019
The Haber-Bosch process is responsible for over 1% of global carbon dioxide emissions every year, making it the biggest CO2 belcher among industrial chemical reactions.
openaire   +1 more source

An approach to the three-dimensional simulations of the Bosch process

Journal of Materials Research, 2011
Abstract
Branislav Radjenović, Marija Radmilović-Radjenović   +1 more
openaire   +1 more source

Influence of operation parameters on BOSCH-process technological characteristics

Materials Today: Proceedings, 2020
Abstract Authors investigated direct plasmachemical etching of silicon with Bosch-process using installation for inductively coupled plasma (PLATRAN-100) in gas area consist of SF6 and CHF3 gases in etching and deposition steps respectively. Defined correlations of etching rate, selectivity Si/photoresist, anisotropy, etch uniformity and sidewall ...
Osipov, A. A., Iankevich, Gleb, Berezenko, V. I., Endiiarova, E. V.   +3 more
openaire   +2 more sources

A modified Bosch-type process for precise surface micromachining of polysilicon

Journal of Micromechanics and Microengineering, 2002
We report on the study of a new plasma process for precise surface micromachining of polysilicon. The principle is based on the adaptation of the well-known Bosch process to polysilicon, alternating etch and passivation steps under inductively coupled plasmas (ICPs).
Quevy, E., Parvais, B., Raskin, J.P., Buchaillot, L., Flandre, D., Collard, D.   +5 more
openaire   +3 more sources