Results 1 to 10 of about 18,005 (143)

Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics [PDF]

Micromachines
This paper delves into the mechanism of the chemical and mechanical action during chemical mechanical polishing (CMP) of monocrystal silicon carbide (SiC) through the molecular dynamics (MD) method.
Yang Lei, Weigang Guo, Kaiping Feng, Zitong Sun   +3 more
doaj   +2 more sources

Monodisperse SiO₂ Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing [PDF]

Nanomaterials
The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge, Yu Cao, Hui Han, Xiaoqi Jin, Jing Liu, Yuhong Jiao, Qiuqin Wang, Yan Gao   +7 more
doaj   +2 more sources

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

Science and Technology of Advanced Materials, 2017
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective
Jessica M. Werrell, Soumen Mandal, Evan L. H. Thomas, Emmanuel B. Brousseau, Ryan Lewis, Paola Borri, Philip R. Davies, Oliver A. Williams   +7 more
doaj   +2 more sources

Chemical-Mechanical Polishing [PDF]

, 2007
CMP is a removal process that strips small portions of film deposited on a wafer by a combination of chemical reaction and mechanical polishing, thus making the surface smoother and more planarized. It is also used to remove bulk dielectric film on the surface to form STI on the silicon substrate, and remove bulk metal film from the wafer surface ...
Gregory Shinn, Vincent Korthuis, Gautum Grover, Simon Fang, Duane Boning   +4 more
  +4 more sources

A New Environmentally Friendly Chemical Mechanical Polishing Method Applied for Surface Finishing Ti-6Al-4V Alloy

Journal of Machine Engineering, 2023
A new eco-friendly slurry has been developed for the chemical mechanical polishing process with a solution of malic acid, deionized water, and an oxidizing agent hydrogen peroxide (H2O2).
Nguyen Minh Quang, Nguyen Ngoc Quan, Nguyen Trong Mai, Le Thi Phuong Thanh, Nguyen Tien Tung, Tran Ngoc Tan, Ha Thanh Hai, Nguyen Duy Trinh   +7 more
doaj   +1 more source

Investigation of Chemical Mechanical Polishing Slurry of magnesium alloy [PDF]

E3S Web of Conferences, 2023
To improve the surface roughness of magnesium alloy, we researched and developed a chemical mechanical polishing (CMP) solution for magnesium alloy, and the effect of sodium tartrate on the surface quality of magnesium alloy and the mechanism of action ...
Zhao Shicheng, Song Xiaoming, Zhang Renjie   +2 more
doaj   +1 more source

CHEMICAL MECHANICAL POLISHING OF NONLINEAR OPTICAL ORGANIC CO-CRYSTALS BASED ON AMINOPYRIDINE SERIES [PDF]

Научно-технический вестник информационных технологий, механики и оптики, 2019
We have studied efficiency of chemical mechanical method for surface polishing of nonlinear optical materials based on aminopyridine series and 4-nitrophenol. Isopropanol (C3H8O) and butanol (C4H9OH) were the solvents utilized for polishing of researched
K. E. Zhevaikin, M. I. Fokina, I. Y. Denisyuk   +2 more
doaj   +1 more source

A New Chemical Mechanical Slurry for Polishing Yttrium Aluminium Garnet Material with Magnesium oxide, Sodium Metasilicate Pentahydrate and Zirconium Dioxide Abrasive Particles

Journal of Machine Engineering, 2023
This work provided a new chemical-mechanical polishing mixture with MgO, sodium metasilicate pentahydrate, ZrO2 abrasive particles, and deionized water.
Le Anh Duc, Pham Minh Hieu, Nguyen Minh Quang   +2 more
doaj   +1 more source

Impact analysis of temperature and humidity effects on polishing [PDF]

EPJ Web of Conferences, 2021
The polishing process for optical glass is one with intertwined chemical and mechanical processes. The aim of the present study is to verify whether control of these factors can be used to improve the efficiency of the polishing process.
Benisch Michael F., Liebl Johannes, Bogner Werner, Fähnle Oliver, Rädlein Edda   +4 more
doaj   +1 more source

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source