Results 191 to 200 of about 6,173 (209)

Chemical mechanical planarization for microelectronics applications

Materials Science and Engineering Reports, 2004
Ashok Kumar
exaly  

RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis

Applied Surface Science, 2020
Shuo Huang
exaly  

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Applied Surface Science, 2011
Wenhu Xu, Jianbin Luo, Guoshun Pan
exaly  

Chemical Mechanical Polishing (CMP) of Fused Silica (FS) Using Ceria Slurry Recycling

ECS Journal of Solid State Science and Technology, 2020
Yan Zhou, Haimei Luo, Guihai Luo, Gaopan Chen, Chengxi Kang, Guoshun Pan   +5 more
openaire   +1 more source

Chemical mechanical polishing: Theory and experiment

Friction, 2013
Dewen Zhao, Xinchun Lu
exaly  

The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)

ECS Journal of Solid State Science and Technology, 2017
Chengwu Wang, Syuhei Kurokawa, Toshiro Doi, Julong Yuan, Yasuhisa Sano, Hideo Aida, Kehua Zhang, Qianfa Deng   +7 more
openaire   +1 more source

WITHDRAWN: Chemical coagulation/floculation treatment of chemical mechanical polishing (CMP) wastewater from photovoltaic industry

Journal of Hazardous Materials, 2008
M. Bouiri, M. Hachemi, A. Maallemi
openaire   +1 more source

Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM), 2019
Shih-Ping Lee, Tzu-Hsuan Tseng, Chih-Hao Chuang, Chien-Ying Chuang, Cheng-Hung Cheng, Hsin-Ying Tung, Pin-Chieh Huang, Chung-Tien Chou   +7 more
openaire   +1 more source

Mechanical aspects of the chemical mechanical polishing process: A review

International Journal of Precision Engineering and Manufacturing, 2016
Hyunseop Lee
exaly  

Role of interaction forces in controlling the stability and polishing performance of CMP slurries

Journal of Colloid and Interface Science, 2003
G Bahar Basim, Ivan U Vakarelski
exaly