Results 181 to 190 of about 6,173 (209)

Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect

Applied Surface Science, 2022
Wantang Wang, Yunhui Shi, Ru Wang
exaly  

Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad

ECS Journal of Solid State Science and Technology, 2012
Hong Jin Kim, Jae Kwang Choi, Myung Ki Hong, Kuntack Lee, Yongsun Ko   +4 more
openaire   +1 more source

Improvement in chemical mechanical polishing of 4H-SiC wafer by activating persulfate through the synergistic effect of UV and TiO2

Journal of Materials Processing Technology, 2021
Wantang Wang, Yunhui Shi, Tengda
exaly  

Process Optimization on Chemical Mechanical Polishing (CMP) for Alleviating the Post-polishing Substrate-platen Adhesion

This study addresses a common problem in disk production where disks stick to machines after polishing. The research identifies key factors that reduce this sticking issue and improve product quality. The study reveals that polishing surface speed significantly influences disk adhesion.
openaire   +1 more source

Polishing Technique and CMP (Chemical & Mechanical Polishing) in Semiconductor Process

Journal of the Society of Mechanical Engineers, 2000
openaire   +1 more source

Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

International Journal of Machine Tools and Manufacture, 2018
Yongchao Xu, Jing Lu
exaly  

CMP – Chemical-Mechanical Polishing

2013
openaire   +1 more source

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Applied Surface Science, 2014
Guoshun Pan, Xiaolei Shi
exaly  

Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP)

2016
openaire   +1 more source

Nd 3+ -doped colloidal SiO 2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers

Applied Surface Science, 2017
Hong Lei
exaly