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Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2009
Wen-Hui Kuan, Ching-Yao Hu
exaly
Wen-Hui Kuan, Ching-Yao Hu
exaly
Experimental Investigation on the Roles of Chemical Corrosion and Mechanical Polishing on Copper CMP
2008Jhy-Cherng Tsai, Tsai Jhy-Cherng
exaly
Chemical mechanical polishing (CMP) of SiC wafer utilizing catalyst in slurry
2014Zhou, Yan +5 more
openaire +1 more source

