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Structurally optimized SiC CMOS FinFET for high-temperature and low-power SoC logic integration. [PDF]

open access: yesSci Rep
Kwon TS   +7 more
europepmc   +1 more source

On-chip integration of achromatic metalens arrays. [PDF]

open access: yesNat Commun
Zhang Y   +9 more
europepmc   +1 more source
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CMOS-Fabricated Ring Surface Ion Trap with TSV Integration

2023 International Electron Devices Meeting (IEDM), 2023
We present the design, fabrication, and test of ring surface trap on 12-inch wafers with a CMOS process. The design is based on Through Silicon Vias (TSV) interconnects.
P. Zhao   +6 more
semanticscholar   +3 more sources

Optical characteristics of CMOS-fabricated MOSFET's

IEEE Journal of Solid-State Circuits, 1987
A CMOS fabricated MOSFET in a floating p-well on a semiconducting n-type substrate is optically sensitive and can be used for photoreception in CMOS circuitry. Experimental results for the logarithmic dependence of threshold voltage V/SUB th/ and channel current I/SUB D/ on light intensity compare well with the theory. However, the floating p-well also
S. D. Kirkish, J. Daly, L. Jou, S. Su
semanticscholar   +3 more sources

CMOS Fabricated by Hybrid-Orientation Technology (HOT)

2007 International Workshop on Electron Devices and Semiconductor Technology (EDST), 2007
Hybrid-orientation technology (HOT), a novel planar CMOS approach that fabricates NMOS on (100) silicon surface and PMOS on (110) silicon surface to take advantage of the highest carrier mobilities on these surfaces, is reviewed. HOT module process flow, defects formed during the HOT module, HOT CMOS performance enhancement and its layout dependence ...
Bin Yang   +14 more
semanticscholar   +2 more sources

Defect cluster segmentation for CMOS fabricated wafers

2009 Innovative Technologies in Intelligent Systems and Industrial Applications, 2009
IC defects, which are essentially present in all fabricated wafers, can either be random defects or belonging to a group of systematic defects. The ability to segment systematic defects that are present in a wafer allows rapid root cause identification and corrective measures to be taken.
W. J. Tee, M. Ooi, Y. Kuang, C. Chan
semanticscholar   +2 more sources

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