Results 51 to 60 of about 1,091,701 (330)
New 3-D CMOS Fabric With Stacked Horizontal Nanowires
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2019 As 2-D CMOS reaches its fundamental scaling limits due to device, manufacturing, and interconnect bottleneck related constraints at the nanoscale, migration to 3-D provides a possible alternative to continue technology scaling in future. Toward that goal, several 3-D integration approaches with multi-die, multichip, and sequential layers stacking are ...
Naveen Kumar Macha +2 more
openaire +1 more source
Nanostructured Metal Oxide Semiconductors towards Greenhouse Gas Detection [PDF]
, 2022 Climate change and global warming are two huge current threats due to continuous anthropogenic emissions of greenhouse gases (GHGs) in the Earth’s atmosphere.
Jean-Marc Tulliani, Mehran Dadkhah
core +1 more source
Synchrotron Radiation for Quantum Technology
Advanced Functional Materials, EarlyView.Materials and interfaces underpin quantum technologies, with synchrotron and FEL methods key to understanding and optimizing them. Advances span superconducting and semiconducting qubits, 2D materials, and topological systems, where strain, defects, and interfaces govern performance.
Oliver Rader +10 more
wiley +1 more source
Comparison of Conventional and Maskless Lithographic Techniques for More than Moore Post-processing of Foundry CMOS Chips [PDF]
, 2020 This article details and compares the technology options for post-processing foundry produced CMOS at chip-scale to enable More than Moore functionality.
Blair, Ewen +10 more
core +3 more sources
Advanced Functional Materials, EarlyView.An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone +11 more
wiley +1 more source
Strain analysis of Ge micro disk using precession electron diffraction [PDF]
, 2019 The recently developed precession electron diffraction (PED) technique in scanning transmission electron microscopy has been used to elucidate the local strain distribution and crystalline misorientation in a CMOS fabricated strained Ge microdisk ...
Ballabio, Andrea +9 more
core +2 more sources
Monolithic sensor integration in CMOS technologies [PDF]
, 2022 © 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new ...
Banerji, Saoni +5 more
core +1 more source
Advanced Functional Materials, EarlyView.Electric control of magnetic tunnel junctions offers a path to drastically reduce the energy requirements of the device. Electric field control of magnetization can be realized in a multitude of ways. These mechanisms can be integrated into existing spintronic devices to further reduce the operational energy.
Will Echtenkamp +7 more
wiley +1 more source
Towards combined quantum bit detection and spatial tracking using an arrayed single-photon sensor [PDF]
, 2021 Experimental quantum key distribution through free-space channels requires accurate pointing-and-tracking to co-align telescopes for efficient transmission.
Buller, Gerald S. +5 more
core +2 more sources
Reconfigurable Three‐Dimensional Superconducting Nanoarchitectures
Advanced Functional Materials, EarlyView.3D superconducting nanostructures offer new possibilities for emergent physical phenomena. However, fabricating complex geometries remains challenging. Here 3D nanoprinting of complex 3D superconducting nanoarchitectures is established. As well as propagating superconducting vortices in 3D, anisotropic superconducting properties with geometric ...
Elina Zhakina +11 more
wiley +1 more source