Results 61 to 70 of about 6,984 (242)

Micro-Optoelectromechanical Tilt Sensor [PDF]

open access: yes, 2008
Published ...
Constandinou, T G, Georgiou, J
core   +3 more sources

Electron–Matter Interactions During Electron Beam Nanopatterning

open access: yesAdvanced Functional Materials, EarlyView.
This article reviews the electron–matter interactions important to nanopatterning with electron beam lithography (EBL). Electron–matter interactions, including secondary electron generation routes, polymer radiolysis, and electron beam induced charging, are discussed.
Camila Faccini de Lima   +2 more
wiley   +1 more source

Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures

open access: yesIEEE Journal of the Electron Devices Society, 2017
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo   +5 more
doaj   +1 more source

A Comparative Study Between a Micromechanical Cantilever Resonator and MEMS-based Passives for Band-pass Filtering Application [PDF]

open access: yes, 2011
Over the past few years, significant growth has been observed in using MEMS based passive components in the RF microelectronics domain, especially in transceiver components.
Anirban Bhattacharya   +7 more
core   +1 more source

Multibit Ferroelectric HfZrO Memcapacitor for Non‐Volatile Analogue Memory and Reconfigurable Electronics

open access: yesAdvanced Functional Materials, EarlyView.
Ferroelectric memcapacitors enable non‐volatile, voltage‐programmable capacitance tuning for adaptive electronics. A TiN/HfZrO/TiN device stack demonstrates more than eight stable capacitance states within a 24 pF memory window in compact 60 ×$\times$ 60 μm2$\umu{\rm m}^{2}$ devices at low operating voltages.
Deepika Yadav   +6 more
wiley   +1 more source

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

open access: yesProceedings, 2017
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng   +6 more
doaj   +1 more source

Monolithic High-Aspect-Ratio Embedded Parylene Channel Technology: Fabrication, Integration, and Applications [PDF]

open access: yes, 2006
This paper presents a novel channel fabrication technology of monolithic bulk-micromachined embedded channels. Based upon implementing two-step complementary dry etching technique and conformal parylene C layer deposition, high-aspect-ratio (internal
Chen, Po-Jui, Tai, Yu-Chong
core   +1 more source

Novel 3D‐Printed Biophotonic Scaffold Displaying Luminescence under Near‐Infrared Light for Photopharmacological Activation and Biological Signaling Compound Release

open access: yesAdvanced Healthcare Materials, EarlyView.
Despite significant efforts in developing novel biomaterials to regenerate tissue, only a few of them have successfully reached clinical use. It has become clear that the next generation of biomaterials must be multifunctional. Smart biomaterials can respond to environmental or external stimuli, interact in a spatial‐temporal manner, and trigger ...
Sonya Ghanavati   +12 more
wiley   +1 more source

A Synovium‐on‐Chip Platform to Study Multicellular Interactions in Arthritis

open access: yesAdvanced Healthcare Materials, EarlyView.
The Synovium‐on‐Chip comprises a thin microporous PDMS membrane to support co‐culture of fibroblast‐like synoviocytes (FLS), THP‐1‐derived macrophages, and endothelial cells, enabling real‐time analysis of synovial‐vascular interactions. FLS migration through the pores drives endothelial remodeling, while TNF‐α stimulation induces robust inflammatory ...
Laurens R. Spoelstra   +8 more
wiley   +1 more source

Etching technique of high aspect ratio silicon trenches based on CMOS-MEMS process

open access: yesDianzi Jishu Yingyong, 2018
Etching technique of deep silicon trenches with high aspect ratio is critical in improving integration and accuracy of Micro-Electro-Mechanical Systems(MEMS)sensor array and reducing the cost of it.
Zhang Haihua, Lv Yufei, Lu Zhongxuan
doaj   +1 more source

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