Results 101 to 110 of about 20,977 (202)
This review focuses on capability of Gallium Nitride (GaN)‐based supercapacitors, bordering the advancement from porous architecture to novel hybrid nanostructures. It systematically investigates synthesis approaches and charge storage mechanisms that generate remarkable energy densities and competent cyclic stability.
Farasat Haider +7 more
wiley +1 more source
Organic Transistor‐Based Neuromorphic Electronics and Their Recent Applications
This review highlights recent progress in organic neuromorphic electronics, showing how organic semiconductors enable synaptic and neuronal functions with low power, mechanical flexibility, and biocompatibility. By bridging materials, devices, and systems, organic platforms are accelerating brain‐inspired computing toward applications in artificial ...
Ziru Wang, Feng Yan
wiley +1 more source
A Smart Active Phase-Change Micropump Based on CMOS-MEMS Technology. [PDF]
Jin W +6 more
europepmc +1 more source
A quad‐cistronic fluorescent biosensor system for real‐time detection of subcellular Ca2+ signals
Background and Purpose The calcium ion (Ca2+) is a versatile cellular messenger regulating a variety of biological processes. Compounds modulating subcellular Ca2+ signals hold substantial pharmacological potential. Advances in fluorescent biosensors have revolutionised Ca2+ imaging.
Anna Lischnig +7 more
wiley +1 more source
Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices
Complementary Metal Oxide Semiconductor (CMOS) and Micro-Electro-Mechanical System (MEMS) devices play significant roles in emerging research fields such as artificial intelligence (AI) [...]
Zhiming Chen
doaj +1 more source
A CMOS-MEMS Pixel Sensor for Thermal Neutron Imaging. [PDF]
Mendicino R, Dalla Betta GF.
europepmc +1 more source
Boolean Computation Using Self-Sustaining Nonlinear Oscillators
Self-sustaining nonlinear oscillators of practically any type can function as latches and registers if Boolean logic states are represented physically as the phase of oscillatory signals.
Roychowdhury, Jaijeet
core +1 more source
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source
Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems [PDF]
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all ...
Marenco, N., Reinert, W., Warnat, S.
core +1 more source
Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique. [PDF]
Shen YX, Tsai YC, Lee CY, Wu CC, Dai CL.
europepmc +1 more source

