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Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design - ICCAD '06, 2006
CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
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CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
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CMOS MEMS - present and future
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), 2003The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, pre-CMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for ...
H. Baltes +4 more
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CMOS-MEMS Capacitive Humidity Sensor
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems, 2009This paper reports a method for improving the sensitivity of integrated capacitive chemical sensors by removing the underlying substrate. The sensor is integrated with CMOS testing electronics using mask-less post-processing followed by inkjet deposition of sensitive polymer.
Nathan Lazarus +3 more
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Proceedings of IEEE Sensors, 2003
The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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CMOS friendly MEMS manufacturing process
1998 IEEE/LEOS Summer Topical Meeting. Digest. Broadband Optical Networks and Technologies: An Emerging Reality. Optical MEMS. Smart Pixels. Organic Optics and Optoelectronics (Cat. No.98TH8369), 2002This paper describes a novel approach to manufacturing technology of optical MEMS devices. The devices are manufactured at a local foundry using fully CMOS compatible front-end processes complemented by unique release and seal processing steps. The paper will cover the process flow, technological challenges and process control issues related to this ...
J. Hunter, M. Bruner, J. Berger
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CMOS-Integrated RF MEMS Resonators
Journal of Microelectromechanical Systems, 2010We present a design approach that enables monolithic integration of high-quality-factor (Q) radio-frequency (RF) microelectromechanical systems (MEMS) resonators with CMOS electronics. Commercially available CMOS processes that feature two polysilicon layers and field oxide isolation can be used to implement this approach.
Maxim K. Zalalutdinov +6 more
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(Invited) CMOS MEMS Integration
ECS Transactions, 2011The "More than Moore" trend in the microelectronics industry is driving a renewed interest in mixed-physics CMOS MEMS integration. Integration becomes a necessity for multi-component microsystems, where interconnect issues are significant. Integration also drives down parasitic capacitances and provides opportunities for ultra-low-power microsystems ...
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High Yield Polymer MEMS Process for CMOS/MEMS Integration
MRS Proceedings, 2011ABSTRACTMEMS community is increasingly using SU-8 as a structural material because it is self-patternable, compliant and needs a low thermal budget. While the exposed layers act as the structural layers, the unexposed SU-8 layers can act as the sacrificial layers, thus making it similar to a surface micromachining process.
Prasenjit Ray +3 more
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High performance MEMS 0.18μm RF-CMOS transformers
2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, 2009This work presents a micromachined RF-CMOS transformer fabricated in a commercially available 0.18μm CMOS process. Maskless micromachining post-processing is used to remove oxide and substrate material from around the transformer, reducing parasitic effects and improving the performance of the transformer.
Shlomo Katz +4 more
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CMOS integrated digital RF MEMS capacitors
2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2011A zero-level packaged, digitally switched, RF MEMS capacitor array has been developed within a mass production capable HV RF CMOS process. These RF MEMS capacitors are grouped in flip-chip cells that exhibit a high quality factor of 87 at 2 GHz, a tuning ratio of almost 10 to 1, a self resonant frequency greater than 5 GHz, and operate using a 3.3V ...
Saravana P Natarajan +3 more
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