Results 41 to 50 of about 20,977 (202)

On the integration of ultrananocrystalline diamond (UNCD) with CMOS chip

open access: yesAIP Advances, 2017
A low temperature deposition of high quality ultrananocrystalline diamond (UNCD) film onto a finished Si-based CMOS chip was performed to investigate the compatibility of the UNCD deposition process with CMOS devices for monolithic integration of MEMS on
Hongyi Mi   +8 more
doaj   +1 more source

Phase Noise Reduction in a VHF MEMS-CMOS Oscillator Using Phononic Crystals

open access: yesIEEE Journal of the Electron Devices Society, 2016
This paper presents experimental results showing reduced phase noise in a very high frequency band microelectromechanical systems (MEMS) oscillator. This has been achieved by engineering the embedded MEMS resonator with phononic crystal structures.
Pei Qin   +3 more
doaj   +1 more source

On the Trade-Off Between Quality Factor and Tuning Ratio in Tunable High-Frequency Capacitors [PDF]

open access: yes, 2009
A benchmark of tunable and switchable devices at microwave frequencies is presented on the basis of physical limitations to show their potential for reconfigurable cellular applications.
Hueting, R.J.E.   +4 more
core   +3 more sources

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

open access: yesSensors, 2011
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive
Mohd Haris Md Khir, Hongwei Qu, Peng Qu
doaj   +1 more source

Experiments and simulations of MEMS thermal sensors for wall shear-stress measurements in aerodynamic control applications [PDF]

open access: yes, 2004
MEMS thermal shear-stress sensors exploit heat-transfer effects to measure the shear stress exerted by an air flow on its solid boundary, and have promising applications in aerodynamic control.
Han, Zhigang   +7 more
core   +1 more source

Characterization of CMOS-MEMS Resonant Pressure Sensors [PDF]

open access: yesIEEE Sensors Journal, 2017
IEEE Comprehensive characterization results of a CMOS-MEMS resonant pressure sensor are presented. We have extensively evaluated the key performance parameters of our device in terms of quality factor (Q) variations under variable conditions of temperature and pressure, characterized by Knudsen number (Kn).
Banerji, Saoni   +2 more
openaire   +3 more sources

MEMS-enabled silicon photonic integrated devices and circuits [PDF]

open access: yes, 2020
Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology ...
Bogaerts, Wim   +8 more
core   +1 more source

Low-Cost Microbolometer Type Infrared Detectors

open access: yesMicromachines, 2020
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications.
Le Yu   +5 more
doaj   +1 more source

Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor

open access: yesFrontiers in Mechanical Engineering, 2022
Environmental sensing units such as gas sensors, humidity sensors, pressure sensors, PM 2.5 sensors, or temperature sensors are widely used in our daily lives. In this study, CMOS-MEMS technology is exploited to fabricate and monolithically integrate the
Ya-Chu Lee   +5 more
doaj   +1 more source

In Situ Study of Resistive Switching in a Nitride‐Based Memristive Device

open access: yesAdvanced Functional Materials, EarlyView.
In situ TEM biasing experiment demonstrates the volatile I‐V characteristic of MIM lamella device. In situ STEM‐EELS Ti L2/L3 ratio maps provide direct evidence of the oxygen vacancies migrations under positive/negative electrical bias, which is critical for revealing the RS mechanism for the MIM lamella device.
Di Zhang   +19 more
wiley   +1 more source

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