Results 51 to 60 of about 20,977 (202)
3D‐Printed Porous Hydroxyapatite Formed via Enzymatic Mineralization
Bone combines lightness, strength, and the ability to heal, inspiring new materials design. This work introduces a room‐temperature, enzyme‐mediated 3D printing method to create porous hydroxyapatite scaffolds. The process avoids energy‐intensive sintering, preserves bioactivity, and allows control over porosity and mineralization.
Francesca Bono +6 more
wiley +1 more source
Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo +5 more
doaj +1 more source
Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper +4 more
doaj +1 more source
A neural probe with up to 966 electrodes and up to 384 configurable channels in 0.13 μm SOI CMOS [PDF]
In vivo recording of neural action-potential and local-field-potential signals requires the use of high-resolution penetrating probes. Several international initiatives to better understand the brain are driving technology efforts towards maximizing the ...
Andrei, Alexandru +13 more
core +1 more source
Ferroelectric memcapacitors enable non‐volatile, voltage‐programmable capacitance tuning for adaptive electronics. A TiN/HfZrO/TiN device stack demonstrates more than eight stable capacitance states within a 24 pF memory window in compact 60 ×$\times$ 60 μm2$\umu{\rm m}^{2}$ devices at low operating voltages.
Deepika Yadav +6 more
wiley +1 more source
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng +6 more
doaj +1 more source
High Density Through Silicon Via (TSV) [PDF]
The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer
Bauer, Tomas, Rimskog, Magnus
core +1 more source
Implantable RF-coiled chip packaging [PDF]
In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils.
Li, W., Rodger, D. C., Tai, Y. C.
core +1 more source
A Synovium‐on‐Chip Platform to Study Multicellular Interactions in Arthritis
The Synovium‐on‐Chip comprises a thin microporous PDMS membrane to support co‐culture of fibroblast‐like synoviocytes (FLS), THP‐1‐derived macrophages, and endothelial cells, enabling real‐time analysis of synovial‐vascular interactions. FLS migration through the pores drives endothelial remodeling, while TNF‐α stimulation induces robust inflammatory ...
Laurens R. Spoelstra +8 more
wiley +1 more source
CMOS-Compatible Room-Temperature Rectifier Toward Terahertz Radiation Detection [PDF]
In this paper, we present a new rectifying device, compatible with the technology of CMOS image sensors, suitable for implementing a direct-conversion detector operating at room temperature for operation at up to terahertz frequencies.
De Amicis, Giovanni +5 more
core +1 more source

