Results 21 to 30 of about 543 (123)

Copper Alloys [PDF]

open access: yes, 2021
Copper has been used for thousands of years. In the centuries, both handicraft and industry have taken advantage of its easy castability and remarkable ductility combined with good mechanical and corrosion resistance.

core   +1 more source

NanoMOF‐Based Multilevel Anti‐Counterfeiting by a Combination of Visible and Invisible Photoluminescence and Conductivity

open access: yesAdvanced Functional Materials, EarlyView.
This study presents novel anti‐counterfeiting tags with multilevel security features that utilize additional disguise features. They combine luminescent nanosized Ln‐MOFs with conductive polymers to multifunctional mixed‐matrix membranes and powder composites. The materials exhibit visible/NIR emission and matrix‐based conductivity even as black bodies.
Moritz Maxeiner   +9 more
wiley   +1 more source

Research Activities of JWRI [PDF]

open access: yes, 2016
s of the ...

core  

Fatigue Properties and Reliability of Solder Joints in BGA Assembly [PDF]

open access: yes, 2022
Lead-free near-eutectic Sn-Ag-Cu (SAC) solder system has raised increasing attention in the electronics industry since the hazardous effects of SnPb solders.
Wei, Xin
core  

Laser‐Induced Graphene from Waste Almond Shells

open access: yesAdvanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova   +9 more
wiley   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Notes and laboratory reports on “Technology of Structural materials and Material Science” Part 2 [PDF]

open access: yes, 2017
“Technology of Structural materials and Material Science” is one of the basic technical disciplines in the syllabus for “Engineering mechanics” field of study.
Bodrova, L.G., Kramar, H.M.
core  

Skin‐Interfaced Therapeutic Patches for Wound Fluid Management and Transdermal Drug Delivery

open access: yesAdvanced Healthcare Materials, EarlyView.
This study presents an integrated skin‐interfaced device combining microfluidics, hydrogel film technology, flexible electronics, and iontophoresis‐based transdermal delivery of PDRN to enhance wound healing. The device effectively manages wound fluid, maintains optimal moisture, and non‐invasively delivers therapeutic drugs.
Dongjun Han   +5 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack   +15 more
wiley   +1 more source

Creep behaviour of the ternary lead-free solder alloy : Sn-3.8wt.%Ag-0.7wt.%Cu [PDF]

open access: yes, 2002
Electronic equipment is facing the challenge of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process ...
Cooper, Shellene
core   +1 more source

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