Results 51 to 60 of about 543 (123)
Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging [PDF]
, 2015 SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point ...
Lei Sun, Liang Zhang
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Recent Progress in Oxide‐Based Na‐Ion Conductors
Advanced Engineering Materials, Volume 28, Issue 6, 18 March 2026.Recent advances in oxide‐based sodium‐ion conductors are reviewed, focusing on β/β″‐alumina, NASICON‐type compounds, and Na5YSi4O12‐type (N5) silicates, together with emerging perovskite and layered oxides. Improvements in ionic conductivity, compositional tuning, and processing are highlighted.
Bowei Xun +3 more
wiley +1 more source
Analysis of inhomogeneous materials at large strains using fast Fourier transform
, 2003 invited lecture at the IUTAM Symposium - Stuttgart 2001International audienceThis paper focuses on a numerical method which has been recently developed to analyze the response of highly inhomogeneous materials, often with complex microstructure.
Lahellec, Noël +3 more
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The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys [PDF]
, 2010 The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In this work, the effects of isothermal aging
Zhang, Yifei
core
Thermoelectric Modules Incorporating MgAgSb and Mg3(Sb,Bi)2 Synthesized Using a Melting Method
Advanced Engineering Materials, Volume 28, Issue 5, 4 March 2026.A scalable synthesis method for a thermoelectric material of MgAgSb is established. A thermoelectric power module of MgAgSb/Mg3(Sb,Bi)2 is fabricated, showing the conversion efficiency of 7.4% at ΔT = 315 K. The performance is comparable to conventional Bi2Te3 modules when they are operated with an air‐cooled heat exchanger.
Kazuo Nagase +8 more
wiley +1 more source
Micropatterned Biphasic Printed Electrodes for High‐Fidelity on‐Skin Bioelectronics
Advanced Functional Materials, Volume 36, Issue 18, 2 March 2026.Micropatterned biphasic printed electrodes achieve unprecedented skin conformity and low impedance by combining liquid‐metal droplets with microstructured 3D lattices. This scalable approach enables high‐fidelity detection of ECG, EMG, and EEG signals, including alpha rhythms from the forehead, with long‐term comfort and stability.
Manuel Reis Carneiro +4 more
wiley +1 more source
Advanced Functional Materials, Volume 36, Issue 22, 16 March 2026.Stretchable p/n‐pair Ag@Ag2Se TE fibers are developed for next‐generation fiber‐based electronics. The TE fibers maintain excellent electrical conductivity and a high Seebeck coefficient under strain. Integrated into textiles, they enable simultaneous temperature and strain sensing, as well as energy harvesting, offering great potential for ...
Chaebeen Kwon +6 more
wiley +1 more source
Decoding NASICON and Its Metal Interface for Solid‐State Batteries
Advanced Materials, Volume 38, Issue 17, 20 March 2026.This review paper focuses on lithium‐ and sodium‐based NASICON solid electrolytes and their interfaces with metal anodes using a top‐down framework. It begins with NASICON fundamentals, elucidates anode‐induced failure mechanisms, surveys advanced characterization strategies to understand them, summarizes mitigation approaches, and concludes with a ...
Jiaqi Xu +8 more
wiley +1 more source
Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging. [PDF]
Sci Rep, 2023 Wang J +7 more
europepmc +1 more source
Materials review for improved automotive gas turbine engine [PDF]
The potential role of superalloys, refractory alloys, and ceramics in the hottest sections of engines operating with turbine inlet temperatures as high as 1370 C is examined.
Belleau, C., Ehlers, W. L., Hagen, F. A.
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