Results 111 to 120 of about 169 (158)

Optical Phased Arrays on Photonic Integrated Circuit Platforms: Challenges, Opportunities, and Future Applications

open access: yesNanophotonics, Volume 15, Issue 14, 27 July 2026.
Integrated optical phased arrays are emerging as scalable engines for solid‐state beam steering and programmable wavefront control. This Review maps the field from beam‐steering principles and core building blocks to material platforms, system‐level bottlenecks, and application frontiers, highlighting how heterogeneous integration, aperiodic ...
Jingwei Li   +7 more
wiley   +1 more source

Numerical Simulation of Cryogenic Etching: Model with Delayed Desorption

Russian Microelectronics, 2021
A numerical model of the evolution of the trench profile during cryogenic etching in SF6/O2 plasma based on the cellular representation of the surface state, the Monte Carlo method for calculating particle fluxes, and the scheme of delayed desorption of reaction products is proposed.
Vladimir Lukichev, Lukichev V F
exaly   +2 more sources

Cryogenic etching of deep narrow trenches in silicon

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 2000
Deep and narrow anisotropic etching of silicon structures has been investigated in a low-pressure high density plasma reactor working with a cryogenic chuck. We have previously demonstrated the feasibility of this technique on such structures. Improvement of etch rate and profiles has been studied and new results show 2 μm wide trenches etched to a ...
Ranson P
exaly   +2 more sources

Numerical study of aperture shape effects in deep cryogenic etching of silicon

International Conference on Micro- and Nano-Electronics 2021, 2022
Cryogenic etching of silicon in SF6/O2 plasma is the process of choice for fabrication of deep high aspect ratio structures with strict requirements for the sidewall angle, surface roughness and contamination, including MEMS, X-ray optics, and supercapacitors.
Andrey Miakonkikh, Vladimir Lukichev
exaly   +2 more sources

HARDWARE DESIGN FOR CRYOGENIC ETCHING EQUIPMENT

Heat Transfer Research, 2021
Sang Jeen Hong
exaly   +2 more sources

ICP cryogenic dry etching for shallow and deep etching in silicon

SPIE Proceedings, 2009
We achieved to etch nano- and deep structures in silicon using ICP-cryogenic dry etching process. We etched nanopores and nanocantilevers with an etch rate of 13 nm/min, nanopillars with an etch rate of 2.8 μm/min - 4.0 μm/min, membrane and cantilever structures with an etch rate of 4 μm/min and 3 μm/min, respectively.
Ü. Sökmen   +6 more
openaire   +1 more source

Cryogenic reactive ion etching of silicon in SF6

Applied Physics Letters, 1990
Reactive ion etching of Si and SiO2 in SF6 plasmas in which the samples are mounted on a liquid-nitrogen-cooled electrode has been studied. At this temperature SF6 condenses on the electrode surface, but it is possible to maintain a plasma. Si etch anisotropy has been demonstrated at low temperature, in agreement with previous studies.
Tim D. Bestwick   +2 more
openaire   +1 more source

Cryogenic electron cyclotron resonance plasma etching

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1992
A cryogenic electron cyclotron resonance (ECR) plasma etching system has been built to study wafer temperature in the Si etching characteristics. The wafer temperature was controlled from −150 to +30 °C during etching using the liquid nitrogen cooled helium gas.
Ki Woong Whang   +2 more
openaire   +1 more source

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