Results 171 to 180 of about 19,615 (204)

Microfluidic device based on deep reactive ion etching process and its lag effect for single cell capture and extraction

Sensors and Actuators B: Chemical, 2018
We introduced a microfluidic device for high-efficiency single cell capture and their subsequent extraction. It was fabricated by using a deep reactive ion etching process taking advantage of the lag effect.
Pavel Neužil, Jianguo Feng, Zdenka Fohlerova   +2 more
exaly   +2 more sources

Deep reactive ion etching of PZT ceramics and PMN-PT single crystals for high frequency ultrasound transducers

Ceramics International, 2015
Peng Shi, Junshan Zhang
exaly   +2 more sources

Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures

Sensors and Actuators A: Physical, 1996
E. Klaassen, K. Petersen, J. M. Noworolski, J. Logan, N. Maluf, Joseph J. Brown, C. Storment, Wendell Mcculley, G. Kovacs   +8 more
exaly   +2 more sources

Deep reactive ion etching

Handbook of Silicon Based MEMS Materials and Technologies, 2020
This chapter discusses the deep reactive ion etching in detail. Reactive Ion Etching (RIE), also known as plasma etching or dry etching, and its extension deep reactive ion etching (DRIE) are processes that combine physical and chemicals effect to remove
F. Laermer, S. Franssila, L. Sainiemi, K. Kolari   +3 more
semanticscholar   +1 more source

Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process

Journal of microelectromechanical systems, 2018
This paper reports an advanced deep reactive ion etching (DRIE) process for realizing ultra-deep (>500- $\mu \text{m}$ ) and ultra-high aspect-ratio (UHAR) silicon structures (AR > 40 for 1-mm through-trench etch, $\text {AR}\approx 80$ for 500- $\mu ...
Yemin Tang, A. Sandoughsaz, K. Owen, K. Najafi   +3 more
semanticscholar   +1 more source

Silicon Deep Reactive Ion Etching with aluminum hard mask

Materials Research Express, 2019
Silicon Deep Reactive Ion Etching (DRIE) process using a multi-layer mask containing a sputtered Aluminum thin film is studied. Aluminum is a candidate for very high aspect ratio DRIE, due to tis very low etch rate, but its adoption is hindered by the ...
A. Bagolini, Pietro Scauso, S. Sanguinetti, P. Bellutti   +3 more
semanticscholar   +1 more source

Deep, vertical etching for GaAs using inductively coupled plasma/reactive ion etching

, 2020
Deep etched structures in GaAs have many applications in optoelectronics and MEMS devices. These applications often require an anisotropic etch profile with smooth sidewalls as well as a high etch rate and high aspect ratio.
Katherine Booker, Y. O. Mayon, Christopher Jones, M. Stocks, A. Blakers   +4 more
semanticscholar   +1 more source

Nanoindentation of crystalline silicon pillars fabricated by soft UV nanoimprint lithography and cryogenic deep reactive ion etching

Sensors and Actuators A-Physical, 2018
Nanomechanical properties of bulk and micro-pillared monocrystalline silicon are experimentally investigated using nanoscale depth-sensing indentation technique.
G. Hamdana, P. Puranto, J. Langfahl-Klabes, Zhi Li, F. Pohlenz, Min Xu, T. Granz, M. Bertke, H. S. Wasisto, U. Brand, E. Peiner   +10 more
semanticscholar   +1 more source

Diamond Microstructuring by Deep Anisotropic Reactive Ion Etching

Physica Status Solidi (a), 2018
Fabrication of diamond micro‐patterned structures is a technological challenge due to the outstanding hardness and chemical stability of the material. In this work, the synthetic diamond reactive ion etching (RIE) process is studied.
A. Golovanov, V. Bormashov, N. V. Luparev, S. Tarelkin, S. Troschiev, S. Buga, V. Blank   +6 more
semanticscholar   +1 more source

Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask

Journal of microelectromechanical systems, 2017
A. Bagolini, S. Ronchin, P. Bellutti, Matteo Chistè, M. Verotti, N. Belfiore   +5 more
semanticscholar   +1 more source