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Experimental study of inductively coupled plasma etching of patterned single crystal diamonds. [PDF]
Zhao L +5 more
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Wafer-Bonded AlGaInP Red LEDs with Suppressed S-Droop through Surface Sulfidation. [PDF]
Lee JS +16 more
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Overcoming Material Incompatibility via 2D Free-Surface Engineering. [PDF]
Bioud YA +9 more
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Low-dimensional materials for intracellular electrophysiology: advances from synthesis to applications. [PDF]
Li A +5 more
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Tapered Cladding Design for Monolithic Waveguide-Photodetector Coupling in Si-Based Integrated Photonics. [PDF]
Gonzalez-Fernandez AA +3 more
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Reactive ion etching and deep reactive ion etching processes
2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 2022Semiconductor technology is a new technology that has only begun to develop in recent decades, but after just a few decades of development, it has become one of the largest industries in the world today, and it exists in many products in our daily lives.
YiHan WU, HaiLin He
openaire +2 more sources
Handbook of Silicon Based MEMS Materials and Technologies, 2010
This chapter discusses the deep reactive ion etching in detail. Reactive Ion Etching (RIE), also known as plasma etching or dry etching, and its extension deep reactive ion etching (DRIE) are processes that combine physical and chemicals effect to remove
Laermer, Franz +3 more
semanticscholar +7 more sources
This chapter discusses the deep reactive ion etching in detail. Reactive Ion Etching (RIE), also known as plasma etching or dry etching, and its extension deep reactive ion etching (DRIE) are processes that combine physical and chemicals effect to remove
Laermer, Franz +3 more
semanticscholar +7 more sources
Ultrahigh Resolution Titanium Deep Reactive Ion Etching
ACS Applied Materials & Interfaces, 2017Titanium (Ti) represents a promising new material for microelectromechanical systems (MEMS) because of its unique properties. Recently, this has been made possible with the advent of processes that enable deep reactive ion etching (DRIE) of high-aspect-ratio (HAR) structures in bulk Ti substrates.
Bryan W. K. Woo +5 more
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