Results 261 to 270 of about 8,725 (286)

Deep reactive ion etching characteristics of a macromachined chemical reactor

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2003
While deep reactive ion etching using an inductively coupled plasma (ICP) source has proven to be a boon to the fabrication of silicon-based microelectromechanical systems, the process is highly sensitive to the geometry of any given device and needs to be modified accordingly.
R. S. Besser, W. C. Shin
openaire   +1 more source

DEEP REACTIVE ION ETCHING FOR PILLAR TYPE NANOPHOTONIC CRYSTAL

International Journal of Nanoscience, 2005
Experimental results and techniques developed for time multiplexed deep reactive ion etching of nano-photonic crystals are presented. Specifically, the high aspect ratio pillar type two-dimensional photonic crystal (PhC) structure on silicon is fabricated and studied for its high potential in application to lightwave circuits and also for discussion ...
SELIN H. G. TEO, A. Q. LIU, G. L. SIA, C. LU, J. SINGH, M. B. YU   +5 more
openaire   +1 more source

Deep reactive ion etching of through silicon vias

2008
This chapter contains sections titled: • Introduction• DRIE Equipment and Characterization• DRIE Processing• Practical Solutions in Via Etching• Concluding Remarks• Appendix A: Glossary of Abbreviations• Appendix B: Examples of DRIE Recipes ...
Roozeboom, Fred, Blauw, Michiel A., Lamy, Yann, van Grunsven, Eric, Dekkers, Wouter, Verhoeven, Jan F., van den Heuvel, Eric F., van der Drift, Emile, Kessels, Erwin W.M.M., van de Sanden, Richard M.C.M.   +9 more
openaire   +1 more source

Deep Reactive Ion Etched Submicron Beam/Trench Characterization

Micro-Electro-Mechanical Systems (MEMS), 2001
Abstract Sub-micron width high aspect ratio beam/trench arrays are etched into silicon substrates using a Surface Technology Systems (STS) deep reactive ion etch (RIE) tool equipped with a time multiplexed plasma etch/passivation cycle scheme.
Gary O’Brien, Xing Cheng, L. J. Guo
openaire   +1 more source

Deep Reactive Ion Etching

2010
Laermer, Franz, Franssila, Sami, Sainiemi, Lauri, Kolari, Kai   +3 more
openaire   +6 more sources

Superhydrophobic silicon surfaces with micro–nano hierarchical structures via deep reactive ion etching and galvanic etching

Journal of Colloid and Interface Science, 2011
Yang He, Chengyu Jiang, Weizheng Yuan
exaly  

Deep Reactive Ion Etching of Polyimide for Microfluidic Applications

Journal of the Korean Physical Society, 2007
T. N. T. Nguyen, N.-E. Lee
openaire   +1 more source

Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures

Sensors and Actuators A: Physical, 1996
Joseph Brown, Gregory T A Kovacs
exaly  

Deep Reactive Ion Silicon Etching

2011
openaire   +1 more source

DRIE (Deep Reactive Ion Etching)

2008
openaire   +1 more source