Results 271 to 280 of about 53,870 (328)

Aspect ratio dependent etching in advanced deep reactive ion etching of quartz

2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017
Quartz due to its piezoelectricity and its good temperature stability is one of the most used materials in devices for time-frequency applications. Quartz resonators are generally obtained by chemical etching or chemical mechanical polishing but these two methods do not allow the shrinking of the dimensions of the devices and limit reachable geometry ...
P. Chapellier, P. Lavenus, B. Bourgeteau-Verlhac, C. Gageant, O. Le Traon, B. Dulmet   +5 more
openaire   +1 more source

Micromachined Faraday cup array using deep reactive ion etching

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090), 2002
A micromachined Faraday cup array (MFCA) for position sensitive ion detection has been developed using a deep reactive ion etching (DRIE) process. Linear, closely spaced arrays of 64, 128, and 256 cups have been produced with pitches of 250 /spl mu/m and 150 /spl mu/m.
Robert B Darling, Adi A Scheidemann, K.N Bhat, T.-C Chen   +3 more
openaire   +1 more source

DEEP REACTIVE ION ETCHING FOR PILLAR TYPE NANOPHOTONIC CRYSTAL

International Journal of Nanoscience, 2005
Experimental results and techniques developed for time multiplexed deep reactive ion etching of nano-photonic crystals are presented. Specifically, the high aspect ratio pillar type two-dimensional photonic crystal (PhC) structure on silicon is fabricated and studied for its high potential in application to lightwave circuits and also for discussion ...
SELIN H. G. TEO, A. Q. LIU, G. L. SIA, C. LU, J. SINGH, M. B. YU   +5 more
openaire   +1 more source

Deep reactive ion etching of through silicon vias

2008
This chapter contains sections titled: • Introduction• DRIE Equipment and Characterization• DRIE Processing• Practical Solutions in Via Etching• Concluding Remarks• Appendix A: Glossary of Abbreviations• Appendix B: Examples of DRIE Recipes ...
Roozeboom, Fred, Blauw, Michiel A., Lamy, Yann, van Grunsven, Eric, Dekkers, Wouter, Verhoeven, Jan F., van den Heuvel, Eric F., van der Drift, Emile, Kessels, Erwin W.M.M., van de Sanden, Richard M.C.M.   +9 more
openaire   +1 more source

Deep reactive ion etching for lateral field emission devices

IEEE Electron Device Letters, 2000
The authors describe the design, fabrication and testing of lateral field emission diodes utilizing the deep reactive ion etch (DRIE). Devices were fabricated on silicon-on-insulator (SOI) wafers of varied thickness, by etching the device silicon in the STS DRIE system in a single mask process.
V. Milanovic, L. Doherty, D.A. Teasdale, C. Zhang, S. Parsa, V. Nguyen, M. Last, K.S.J. Pister   +7 more
openaire   +1 more source

Spatial variation of the etch rate for deep etching of silicon by reactive ion etching

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 1997
The macroscopic uniformity of deep etching into silicon by reactive ion etching (RIE) with a SF6−O2 plasma was studied. The spatial variation of the etch rate across a 4 inch wafer in a single wafer system is a function of the process parameters and the configuration of the etch chamber.
Bo Asp Mo/ller Andersen, Ole Hansen, Martin Kristensen   +2 more
openaire   +1 more source

Deep Vertical Etching of Silicon Wafers Using a Hydrogenation-Assisted Reactive Ion Etching

Journal of Microelectromechanical Systems, 2007
A novel hydrogenation-assisted deep reactive ion etching of silicon is reported. The process uses sequential hydrogen-assisted passivation and plasma etching at low-density plasma powers to stimulate the vertical removal of the exposed Si substrate.
Amir Sammak, Soheil Azimi, Nima Izadi, Bahar Khadem Hosseinieh, Shams Mohajerzadeh   +4 more
openaire   +1 more source

Deep reactive ion etching and focused ion beam combination for nanotip fabrication

Materials Science and Engineering: C, 2006
Abstract We have studied the fabrication of high-aspect ratio silicon tips by a combination of deep reactive ion etching and focused ion beam. The reactive ion etching is used to obtain so-called “rocket tips” which can be fabricated with a high aspect ratio.
G. Villanueva, J.A. Plaza, A. Sánchez-Amores, J. Bausells, E. Martínez, J. Samitier, A. Errachid   +6 more
openaire   +1 more source

Integrating QSAR modelling and deep learning in drug discovery: the emergence of deep QSAR

Nature Reviews Drug Discovery, 2023
Artem Cherkasov, Gisbert Schneider, Alexandre Varnek   +2 more
exaly  

Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask

Journal of microelectromechanical systems, 2017
A. Bagolini, S. Ronchin, P. Bellutti, Matteo Chistè, M. Verotti, N. Belfiore   +5 more
semanticscholar   +1 more source